ELECTRONIC DEVICE COMPRISING SPEAKER MODULE

An electronic device according to an embodiment comprises: a housing including a support including a through hole; a display; a speaker module which includes a speaker and an enclosure surrounding the speaker, and is located below the support; a shield can located below the support and spaced apart...

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Main Authors KIM, Donghyun, KIM, Kiwon, LEE, Byounghee, CHO, Joonrae, CHO, Woojin, PARK, Youngbae, LEE, Dongyoung, PARK, Choonghyo, SIM, Myoungsung
Format Patent
LanguageEnglish
French
Korean
Published 15.08.2024
Subjects
CALCULATING
COMPUTING
COUNTING
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PHYSICS
PUBLIC ADDRESS SYSTEMS
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Summary:An electronic device according to an embodiment comprises: a housing including a support including a through hole; a display; a speaker module which includes a speaker and an enclosure surrounding the speaker, and is located below the support; a shield can located below the support and spaced apart from the speaker module and covering electronic components disposed on a printed circuit board; and a connection structure located below the through hole so as to connect a first space between the speaker and the enclosure, to a second space between the printed circuit board and the shield can. Selon un mode de réalisation, un dispositif électronique qui comprend : un boîtier comprenant un support comprenant un trou traversant ; un écran ; un module de haut-parleur qui comprend un haut-parleur et une enceinte entourant le haut-parleur, et est situé au-dessous du support ; un blindage peut être situé au-dessous du support et espacé du module de haut-parleur et recouvrir des composants électroniques disposés sur une carte de circuit imprimé ; et une structure de raccordement située au-dessous du trou traversant de façon à relier un premier espace entre le haut-parleur et l'enceinte, à un second espace entre la carte de circuit imprimé et le boîtier de blindage. 일 실시예에 따른 전자 장치는, 관통 홀을 포함하는 지지부재(support)를 포함하는 하우징, 디스플레이, 스피커 및 상기 스피커를 감싸는 인클로저(enclosure)를 포함하고, 상기 지지부재 아래에 위치되는 스피커 모듈, 상기 지지부재 아래에서, 상기 스피커 모듈로부터 이격되고(spaced apart from), 인쇄 회로 기판 상에 배치된 전자 부품들을 커버하는 실드 캔, 및 상기 스피커와 인클로저 사이의 제1 공간을, 상기 관통 홀을 통해, 상기 인쇄 회로 기판과 상기 실드 캔 사이의 제2 공간과 연결하도록, 상기 관통 홀 아래에 위치되는 연결 구조를 포함한다.
Bibliography:Application Number: WO2023KR21955