METHOD TO JOIN A SUPPORT FOR AN ELECTRONIC DEVICE TO A VULCANISED TYRE
Method for joining a support (8; 36) for an electronic device (7) to a vulcanized tyre (1). The support (8; 36) is provided with at least one at least partially green rubber component (9) having a connection surface (S). The method comprises the steps of: applying the support (8; 36) to a wall of th...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
18.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Method for joining a support (8; 36) for an electronic device (7) to a vulcanized tyre (1). The support (8; 36) is provided with at least one at least partially green rubber component (9) having a connection surface (S). The method comprises the steps of: applying the support (8; 36) to a wall of the tyre (1) placing the connection surface (S) of the support (8; 36) in direct contact with the wall of the tyre (1); and pre-heating the support (8; 36) in such a way that at the moment of applying the support (8; 36) to the wall of the tyre (1) the connection surface (S) of the support (8; 36) has a temperature that is greater than the temperature of the vulcanized tyre (1).
L'invention concerne un procédé d'assemblage d'un support (8 ; 36) pour un dispositif électronique (7) à un pneu vulcanisé (1). Le support (8 ; 36) est pourvu d'au moins un composant en caoutchouc au moins partiellement vert (9) ayant une surface de liaison (S). Le procédé comprend les étapes consistant à : appliquer le support (8 ; 36) sur une paroi du pneu (1) plaçant la surface de liaison (S) du support (8 ; 36) en contact direct avec la paroi du pneu (1) ; et préchauffer le support (8 ; 36) de telle sorte qu'au moment de l'application du support (8 ; 36) sur la paroi du pneu (1), la surface de liaison (S) du support (8 ; 36) a une température qui est supérieure à la température du pneu vulcanisé (1). |
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Bibliography: | Application Number: WO2024IB50157 |