SYSTEMS AND METHODS FOR CRYOGENIC COOLING

A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to t...

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Bibliographic Details
Main Authors CHEUNG, Rick Chun Kit, GREGORY, Luke Thomas
Format Patent
LanguageEnglish
French
Published 04.01.2024
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K. L'invention concerne un système informatique et des procédés associés. Le système informatique comprend un composant de génération de chaleur. Le système informatique comprend une plaque d'évaporation reliée thermiquement au composant de génération de chaleur. Le système informatique comprend un système de refroidissement cryogénique positionné à proximité de la plaque d'évaporation. Le système de refroidissement cryogénique est configuré pour libérer un fluide cryogénique sur la plaque d'évaporation pour refroidir le composant de génération de chaleur. Le fluide cryogénique a un point d'ébullition inférieur à 273 K.
Bibliography:Application Number: WO2023US22628