EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED PRODUCT OF SAME

Provided is an epoxy resin composition which has favorable melt-kneading properties at 100°C or less and exhibits excellent solvent solubility, produces a cured product thereof which exhibits excellent heat resistance, heat decomposition stability, thermal conductivity, and tracking resistance, and...

Full description

Saved in:
Bibliographic Details
Main Authors OMURA Masaki, HIROTA Ken
Format Patent
LanguageEnglish
French
Japanese
Published 05.01.2023
Subjects
Online AccessGet full text

Cover

Loading…