ETCHING SOLUTION COMPOSITION, PRODUCTION METHOD FOR SAID ETCHING SOLUTION COMPOSITION, AND ETCHING METHOD USING SAID ETCHING SOLUTION COMPOSITION

• Main Authors: INAZUMI, Hiroki, SHIMIZU, Toshikazu, YOSHIDA, Yuki
• Format: Patent
• Language: English; French; Japanese
• Published: 10.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

The present invention addresses the problem of providing an etching solution composition that imparts a good etched surface shape to a metal to be etched at a controlled etch rate.　The present invention relates to an etching solution composition obtained by blending at least (A) nitric acid, (B) ace...