SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporti...
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Format | Patent |
Language | English French Japanese |
Published |
22.06.2023
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Abstract | This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).
Ce dispositif de traitement de substrat comprend : une partie de retenue de substrat (5) pourvue d'une face de maintien d'aspiration (5a) pour retenir une première face (2a) d'un substrat (W) ; une tête de traitement (7) conçue pour traiter une partie périphérique externe du substrat (W) ; une plaque de pression statique (9) pourvue d'une face de support de fluide (9a) opposée à la face de maintien d'aspiration (5a) ; et une conduite d'alimentation en fluide (10) reliée à la plaque de pression statique (9) et alimentant en fluide un espace entre la face de support de fluide (9a) et une seconde face (2b) du substrat (W). La seconde face (2b) est opposée à la première face (2a) du substrat (W). La face de support de fluide (9a) est plus grande que la face de maintien d'aspiration (5a).
基板処理装置は、基板(W)の第1の面(2a)を保持するための吸着保持面(5a)を有する基板保持部(5)と、基板(W)の外周部を処理するように配置された処理ヘッド(7)と、吸着保持面(5a)に対向する流体支持面(9a)を有する静圧プレート(9)と、静圧プレート(9)に連結され、流体支持面(9a)と基板(W)の第2の面(2b)との間の空間に流体を供給する流体供給ライン(10)を備える。第2の面(2b)は、基板(W)の第1の面(2a)とは反対側の面であり、流体支持面(9a)は吸着保持面(5a)よりも大きい。 |
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AbstractList | This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).
Ce dispositif de traitement de substrat comprend : une partie de retenue de substrat (5) pourvue d'une face de maintien d'aspiration (5a) pour retenir une première face (2a) d'un substrat (W) ; une tête de traitement (7) conçue pour traiter une partie périphérique externe du substrat (W) ; une plaque de pression statique (9) pourvue d'une face de support de fluide (9a) opposée à la face de maintien d'aspiration (5a) ; et une conduite d'alimentation en fluide (10) reliée à la plaque de pression statique (9) et alimentant en fluide un espace entre la face de support de fluide (9a) et une seconde face (2b) du substrat (W). La seconde face (2b) est opposée à la première face (2a) du substrat (W). La face de support de fluide (9a) est plus grande que la face de maintien d'aspiration (5a).
基板処理装置は、基板(W)の第1の面(2a)を保持するための吸着保持面(5a)を有する基板保持部(5)と、基板(W)の外周部を処理するように配置された処理ヘッド(7)と、吸着保持面(5a)に対向する流体支持面(9a)を有する静圧プレート(9)と、静圧プレート(9)に連結され、流体支持面(9a)と基板(W)の第2の面(2b)との間の空間に流体を供給する流体供給ライン(10)を備える。第2の面(2b)は、基板(W)の第1の面(2a)とは反対側の面であり、流体支持面(9a)は吸着保持面(5a)よりも大きい。 |
Author | OHASHI, Hirotaka |
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DocumentTitleAlternate | 基板処理装置および基板処理方法 DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT |
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Snippet | This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W);... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
Title | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD |
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