FLIP CHIP PACKAGE AND METHOD FOR FABRICATING A FLIP CHIP PACKAGE

• Main Authors: ORATTI KALANDAR, Navas Khan, SORIC, Mario, RAU, Ingolf, V C MUNIANDY, Kesvakumar, KIM, Do Hyung, MIRANDA, Ariel Lizaba
• Format: Patent
• Language: English; French
• Published: 13.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A flip chip package comprises a substrate, a semiconductor die comprising a front side, an opposing backside and lateral sides connecting the front side and the backside, the semi-conductor die being arranged on the substrate such that the front side faces the substrate, a molded body at least parti...