THERMALLY CONDUCTIVE FILM
The present invention provides a thermally conductive film characterized by including: (A) 100 parts by mass of one or more silicone resins selected from DmTφ pDVi n (in the formula, D is (CH3)2SiO2/2, Tφ is a siloxane unit represented by (C6H5)SiO3/2, DVi is (CH3)(CH 2=CH) SiO2/2, m is an integer o...
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30.03.2023
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Abstract | The present invention provides a thermally conductive film characterized by including: (A) 100 parts by mass of one or more silicone resins selected from DmTφ pDVi n (in the formula, D is (CH3)2SiO2/2, Tφ is a siloxane unit represented by (C6H5)SiO3/2, DVi is (CH3)(CH 2=CH) SiO2/2, m is an integer of 35-55, n is an integer of 30-60, and p is an integer of 40-70), or MLDxTφ qDVi y (wherein M is (CH3)3SiO1/2, L is an integer of 10-30, x is an integer of 15-35, y is an integer of 40-60, and q is an integer of 45-55), the silicone resin(s) having non-flowability at 25°C; (B) 5-300 parts by mass of a wax having a melting point of 20-60°C; and (C) 1000-6000 parts by mass of a thermally conductive filler. This provides a thermally conductive film that is easy to handle in the form of a film at room temperature and that is softened by heat.
La présente invention concerne un film thermoconducteur caractérisé en ce qu'il comprend : (A) 100 parties en masse d'une ou plusieurs résines de silicone choisies parmi DmTφ pDVi n (dans la formule, D est (CH3)2SiO2/2, Tφ est une unité siloxane représentée par (C6H5)SiO3/2, DVi est (CH3)(CH 2=CH) SiO2/2, m est un nombre entier de 35 à 55, n est un nombre entier de 30 à 60, et p est un nombre entier de 40 à 70), ou MLDxTφ qDVi y (dans la formule, M est (CH3)3SiO1/2, L est un entier de 10 à 30, x est un entier de 15 à 35, y est un entier de 40 à 60, et q est un entier de 45 à 55), la ou les résines de silicone ayant une non-fluidité à 25°C ; (B) 5 à 300 parties en masse d'une cire ayant un point de fusion entre 20 et 60°C ; et (C) 1000 à 6000 parties en masse d'une charge thermoconductrice. Ainsi, il est possible d'obtenir un film thermoconducteur facile à manipuler sous forme de pellicule à température ambiante et qui se ramollit sous l'effet de la chaleur.
本発明は、(A)DmTφ pDVi n(式中、Dは(CH3)2SiO2/2、Tφは(C6H5)SiO3/2、DViは(CH3)(CH2=CH)SiO2/2で示されるシロキサン単位であり、mは35~55の整数、nは30~60の整数、pは40~70の整数である。)、又はMLDxTφ qDVi y(式中、Mは(CH3)3SiO1/2であり、Lは10~30の整数、xは15~35の整数、yは40~60の整数、qは45~55の整数である。)から選ばれる1種以上の25℃で非流動性を有するシリコーン樹脂:100質量部、(B)融点が20~60℃であるワックス:5~300質量部、(C)熱伝導性充填材:1,000~6,000質量部を含むものであることを特徴とする熱伝導性フィルムである。これにより、常温ではフィルム状で取り扱い性がよい上に、熱によって軟化する熱伝導性フィルムを提供する。 |
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AbstractList | The present invention provides a thermally conductive film characterized by including: (A) 100 parts by mass of one or more silicone resins selected from DmTφ pDVi n (in the formula, D is (CH3)2SiO2/2, Tφ is a siloxane unit represented by (C6H5)SiO3/2, DVi is (CH3)(CH 2=CH) SiO2/2, m is an integer of 35-55, n is an integer of 30-60, and p is an integer of 40-70), or MLDxTφ qDVi y (wherein M is (CH3)3SiO1/2, L is an integer of 10-30, x is an integer of 15-35, y is an integer of 40-60, and q is an integer of 45-55), the silicone resin(s) having non-flowability at 25°C; (B) 5-300 parts by mass of a wax having a melting point of 20-60°C; and (C) 1000-6000 parts by mass of a thermally conductive filler. This provides a thermally conductive film that is easy to handle in the form of a film at room temperature and that is softened by heat.
La présente invention concerne un film thermoconducteur caractérisé en ce qu'il comprend : (A) 100 parties en masse d'une ou plusieurs résines de silicone choisies parmi DmTφ pDVi n (dans la formule, D est (CH3)2SiO2/2, Tφ est une unité siloxane représentée par (C6H5)SiO3/2, DVi est (CH3)(CH 2=CH) SiO2/2, m est un nombre entier de 35 à 55, n est un nombre entier de 30 à 60, et p est un nombre entier de 40 à 70), ou MLDxTφ qDVi y (dans la formule, M est (CH3)3SiO1/2, L est un entier de 10 à 30, x est un entier de 15 à 35, y est un entier de 40 à 60, et q est un entier de 45 à 55), la ou les résines de silicone ayant une non-fluidité à 25°C ; (B) 5 à 300 parties en masse d'une cire ayant un point de fusion entre 20 et 60°C ; et (C) 1000 à 6000 parties en masse d'une charge thermoconductrice. Ainsi, il est possible d'obtenir un film thermoconducteur facile à manipuler sous forme de pellicule à température ambiante et qui se ramollit sous l'effet de la chaleur.
本発明は、(A)DmTφ pDVi n(式中、Dは(CH3)2SiO2/2、Tφは(C6H5)SiO3/2、DViは(CH3)(CH2=CH)SiO2/2で示されるシロキサン単位であり、mは35~55の整数、nは30~60の整数、pは40~70の整数である。)、又はMLDxTφ qDVi y(式中、Mは(CH3)3SiO1/2であり、Lは10~30の整数、xは15~35の整数、yは40~60の整数、qは45~55の整数である。)から選ばれる1種以上の25℃で非流動性を有するシリコーン樹脂:100質量部、(B)融点が20~60℃であるワックス:5~300質量部、(C)熱伝導性充填材:1,000~6,000質量部を含むものであることを特徴とする熱伝導性フィルムである。これにより、常温ではフィルム状で取り扱い性がよい上に、熱によって軟化する熱伝導性フィルムを提供する。 |
Author | AKABANE Emi ISHIHARA Yasuhisa ENDO Akihiro |
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Snippet | The present invention provides a thermally conductive film characterized by including: (A) 100 parts by mass of one or more silicone resins selected from DmTφ... |
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SubjectTerms | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
Title | THERMALLY CONDUCTIVE FILM |
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