POWER MODULE AND POWER CONVERSION DEVICE
Provided is a technique for enabling reduction of thermal stress due to bonding of a heat-dissipating member and an insulating substrate, and suppression of warping of the heat-dissipating member caused by the thermal stress. A power module (202) comprises: a heat-dissipating member (14) including a...
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Main Authors | , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
23.02.2023
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Subjects | |
Online Access | Get full text |
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