METHOD FOR BONDING A THERMOPLASTIC PIPING SYSTEM WITHOUT THE USE OF SOLVENT-BASED ADHESIVES, AND ASSOCIATED ADHESIVE WITHOUT THE USE OF SOLVENTS
Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comprises the steps of i) applying a cyanoacrylate adhesive (2) ont...
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Main Authors | , , , |
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Format | Patent |
Language | English French |
Published |
17.11.2022
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Subjects | |
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Abstract | Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comprises the steps of i) applying a cyanoacrylate adhesive (2) onto at least one surface of the at least one first pipe or fitting part (11), or at least one second pipe or fitting part (12), ii) inserting together the at least one first pipe or fitting part (11), and the at least one second pipe or fitting part (12) before an open time lapses, iii) removing the excess of cyanoacrylate adhesive (2), iv) allowing the adhesive to cure. Associated adhesive for bonding a thermoplastic piping system (1) without the use of solvents, comprising a cyanoacrylate monomer (21), a polymerization inhibitor, a viscosity thickener, and a curing speed adjusting catalyst.
L'invention concerne un procédé de collage d'un système de tuyauterie thermoplastique (1) sans l'utilisation d'adhésifs à base de solvant, le système de tuyauterie (1) comprenant au moins une première partie tuyau ou raccord (11) et au moins une seconde partie tuyau ou raccord (12), le procédé comprenant les étapes consistant à i) appliquer un adhésif à base de cyanoacrylate (2) sur au moins une surface de ladite ou desdites premières parties tuyaux ou raccords (11) ou de ladite ou desdites secondes parties tuyaux ou raccords (12), ii) assembler ladite ou lesdites premières parties tuyaux ou raccords (11) et ladite ou lesdites secondes parties tuyaux ou raccords (12) avant un laps de temps ouvert, iii) éliminer l'excès d'adhésif à base de cyanoacrylate (2) et iv) laisser l'adhésif durcir. L'invention concerne également un adhésif associé pour le collage d'un système de tuyauterie thermoplastique (1) sans l'utilisation de solvants, comprenant un monomère cyanoacrylate (21), un inhibiteur de polymérisation, un épaississant augmentant la viscosité et un catalyseur ajustant la vitesse de durcissement. |
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AbstractList | Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comprises the steps of i) applying a cyanoacrylate adhesive (2) onto at least one surface of the at least one first pipe or fitting part (11), or at least one second pipe or fitting part (12), ii) inserting together the at least one first pipe or fitting part (11), and the at least one second pipe or fitting part (12) before an open time lapses, iii) removing the excess of cyanoacrylate adhesive (2), iv) allowing the adhesive to cure. Associated adhesive for bonding a thermoplastic piping system (1) without the use of solvents, comprising a cyanoacrylate monomer (21), a polymerization inhibitor, a viscosity thickener, and a curing speed adjusting catalyst.
L'invention concerne un procédé de collage d'un système de tuyauterie thermoplastique (1) sans l'utilisation d'adhésifs à base de solvant, le système de tuyauterie (1) comprenant au moins une première partie tuyau ou raccord (11) et au moins une seconde partie tuyau ou raccord (12), le procédé comprenant les étapes consistant à i) appliquer un adhésif à base de cyanoacrylate (2) sur au moins une surface de ladite ou desdites premières parties tuyaux ou raccords (11) ou de ladite ou desdites secondes parties tuyaux ou raccords (12), ii) assembler ladite ou lesdites premières parties tuyaux ou raccords (11) et ladite ou lesdites secondes parties tuyaux ou raccords (12) avant un laps de temps ouvert, iii) éliminer l'excès d'adhésif à base de cyanoacrylate (2) et iv) laisser l'adhésif durcir. L'invention concerne également un adhésif associé pour le collage d'un système de tuyauterie thermoplastique (1) sans l'utilisation de solvants, comprenant un monomère cyanoacrylate (21), un inhibiteur de polymérisation, un épaississant augmentant la viscosité et un catalyseur ajustant la vitesse de durcissement. |
Author | CEREZO JIMENEZ, Jose Ramon JIMENEZ LOPEZ, Juan Jose SANTAMARIA PEDRON, Sara RODRIGUEZ FERNANDEZ, Denis |
Author_xml | – fullname: RODRIGUEZ FERNANDEZ, Denis – fullname: CEREZO JIMENEZ, Jose Ramon – fullname: SANTAMARIA PEDRON, Sara – fullname: JIMENEZ LOPEZ, Juan Jose |
BookMark | eNqNjD8PgjAUxDvo4L_v8BJXSbQMuBb6kCbQEl6BOBFi6mSABD-IH1lIHJyM0-Xufndrtuj6zq3YK0ObGAmxKSA0Wip9AQE2wSIzeSrIqghylc8xXcliBrWaBqWdGSgJwcRAJq1QWy8UhBKETJBUhXQAoSdLZCIl7Ffz44O2bHlvH6PbfXTD9jHaKPHc0DduHNqb69yzqQ0_cs79sx8E4uT_R70B-95DSQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | PROCÉDÉ POUR LE COLLAGE D'UN SYSTÈME DE TUYAUTERIE THERMOPLASTIQUE SANS L'UTILISATION D'ADHÉSIFS À BASE DE SOLVANT ET ADHÉSIF ASSOCIÉ NE NÉCESSITANT PAS L'UTILISATION DE SOLVANTS |
ExternalDocumentID | WO2022238377A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_WO2022238377A13 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 16 05:54:51 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_WO2022238377A13 |
Notes | Application Number: WO2022EP62588 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221117&DB=EPODOC&CC=WO&NR=2022238377A1 |
ParticipantIDs | epo_espacenet_WO2022238377A1 |
PublicationCentury | 2000 |
PublicationDate | 20221117 |
PublicationDateYYYYMMDD | 2022-11-17 |
PublicationDate_xml | – month: 11 year: 2022 text: 20221117 day: 17 |
PublicationDecade | 2020 |
PublicationYear | 2022 |
RelatedCompanies | UNECOL ADHESIVE IDEAS, S.L |
RelatedCompanies_xml | – name: UNECOL ADHESIVE IDEAS, S.L |
Score | 3.441096 |
Snippet | Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING CHEMISTRY COMPOSITIONS BASED THEREON DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL PROCESSES OF COMPOUNDING HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PIPES POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
Title | METHOD FOR BONDING A THERMOPLASTIC PIPING SYSTEM WITHOUT THE USE OF SOLVENT-BASED ADHESIVES, AND ASSOCIATED ADHESIVE WITHOUT THE USE OF SOLVENTS |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221117&DB=EPODOC&locale=&CC=WO&NR=2022238377A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwEA9jivqmU_FjSkDpk0XbZW33MKRtUltZP1iyD59G2rUgSDdcxX_DP9mkbLqnveVyyUEuXHK_JHcB4J53UGZxgVSLvFuoKDUMlVs9Q83SXE9Rp5hrhox3DiPDH6HXaXfaAB-bWJg6T-h3nRxRWFQm7L2q1-vl_yEWrt9Wrh7Td1G1ePZYHytrdKwLOKOZCnb6JIlx7CquK3CbEg1rni7RmGkLrLQnHWmZaZ-MHRmXstzeVLxjsJ8IeWV1Ahp52QKH7ubvtRY4CNdX3qK4tr7VKfgJCfNjDAVwg04c4SB6gTZkPhmGcTKwKQtcmASJrKZvlJEQTgLRYcRkGziiBMYepPFgTCKmOjYlGNrYJzQYE_oA7UiQMsljYLMtzg4Z9AzceYS5viqGNvvT5GwSb-uhcw6a5aLMLwDUupznBbe4iZ4QypE1F55KxjU0t3qWwfVL0N4l6Wo3-xocSVKG8GlmGzSrz6_8RuzlVXpbT8EvS1mXzg |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwEA9jivNNp-LH1IDSJ4u2y9ruYUg_UlvtF0v24dNIuxYEqcNV_Df8k03KpnvaW3KXHOTC5fJLchcAblkXZQbjSLXIe4WMUk2TmdHX5CzN1RR1i7miiXjnMNK8EXqe9qYN8L6OhanzhH7XyRG5RWXc3qt6vV78H2I59dvK5X36xkkfjy4dONIKHasczii65FgDnMRObEu2zXGbFA1rnirQmG5yrLSjc1AoMu3jsSXiUhabTsU9ALsJl1dWh6CRl23Qstd_r7XBXri68ubFlfUtj8BPiKkXO5ADN2jFkeNHT9CE1MPDME4Ck1DfhomfCDJ5JRSHcOLzDiMq2sARwTB2IYmDMY6obJkEO9B0PEz8MSZ30Ix4VSR59E26wdkigxyDGxdT25P50GZ_mpxN4k09dE9As_wo81MAlR5jecEMpqMHhHJkzPlOJWMKmht9Q2PqGehsk3S-nX0NWh4Ng1ngRy8XYF-wRDifondAs_r8yi-5X6_Sq3o6fgGL3Jq5 |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=METHOD+FOR+BONDING+A+THERMOPLASTIC+PIPING+SYSTEM+WITHOUT+THE+USE+OF+SOLVENT-BASED+ADHESIVES%2C+AND+ASSOCIATED+ADHESIVE+WITHOUT+THE+USE+OF+SOLVENTS&rft.inventor=RODRIGUEZ+FERNANDEZ%2C+Denis&rft.inventor=CEREZO+JIMENEZ%2C+Jose+Ramon&rft.inventor=SANTAMARIA+PEDRON%2C+Sara&rft.inventor=JIMENEZ+LOPEZ%2C+Juan+Jose&rft.date=2022-11-17&rft.externalDBID=A1&rft.externalDocID=WO2022238377A1 |