SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

According to a specific embodiment of the present disclosure, an apparatus may comprise: an upper case facing a first direction; a lower case facing a second direction opposite to the first direction, the lower case being coupled to the upper case to form an inner space; and a speaker module dispose...

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Main Authors KIM, Donghyun, JO, Nammin, CHO, Joonrae, YU, Juyoung, PARK, Youngbae
Format Patent
LanguageEnglish
French
Korean
Published 27.10.2022
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Abstract According to a specific embodiment of the present disclosure, an apparatus may comprise: an upper case facing a first direction; a lower case facing a second direction opposite to the first direction, the lower case being coupled to the upper case to form an inner space; and a speaker module disposed in the inner space. The speaker module may comprise: a speaker; a bracket surrounding at least a portion of the speaker, the bracket comprising a first opening positioned to receive a sound generated from the speaker, at least one first portion coupled to the upper case, and at least one second portion coupled to the lower case; at least one first sealing member disposed on the at least one first portion of the bracket to seal the bracket and the upper case; and a second sealing member disposed on the at least one second portion of the bracket to seal the bracket and the lower case. Selon un mode de réalisation spécifique de la présente invention, un appareil peut comprendre : un boîtier supérieur faisant face à une première direction ; un boîtier inférieur faisant face à une seconde direction opposée à la première direction, le boîtier inférieur étant couplé au boîtier supérieur pour former un espace intérieur ; et un module de haut-parleur disposé dans l'espace intérieur. Le module de haut-parleur peut comprendre : un haut-parleur ; un support entourant au moins une partie du haut-parleur, le support comprenant une première ouverture positionnée pour recevoir un son généré par le haut-parleur, au moins une première partie couplée au boîtier supérieur, et au moins une seconde partie couplée au boîtier inférieur ; au moins un premier élément d'étanchéité disposé sur la au moins une première partie du support pour sceller le support et le boîtier supérieur ; et un second élément d'étanchéité disposé sur la au moins une seconde partie du support pour sceller le support et le boîtier inférieur. 본 개시의 특정 실시예에 따르면, 장치(apparatus)는, 제1 방향을 향하는 상부 케이스; 상기 제1 방향과 반대인 제2 방향을 향하는 하부 케이스로서, 상기 상부 케이스와 결합되어 내부 공간을 형성하는 하부 케이스; 상기 내부 공간 내에 배치된 스피커 모듈을 포함하며, 상기 스피커 모듈은, 스피커; 상기 스피커의 적어도 일부를 감싸는 브라켓으로서, 상기 브라켓은, 상기 스피커로부터 발생되는 음향을 수용하도록 위치되는 제1 개구; 상기 상부 케이스와 결합되는 적어도 하나의 제1 부분; 및 상기 하부 케이스와 결합되는 적어도 하나의 제2 부분을 포함하고, 상기 브라켓의 상기 적어도 하나의 제1 부분에 배치되어 상기 브라켓과 상기 상부 케이스를 실링하는 적어도 하나의 제1 실링 부재; 및 상기 브라켓의 상기 적어도 하나의 제2 부분에 배치되어 상기 브라켓과 상기 하부 케이스를 실링하는 제2 실링 부재를 포함할 수 있다.
AbstractList According to a specific embodiment of the present disclosure, an apparatus may comprise: an upper case facing a first direction; a lower case facing a second direction opposite to the first direction, the lower case being coupled to the upper case to form an inner space; and a speaker module disposed in the inner space. The speaker module may comprise: a speaker; a bracket surrounding at least a portion of the speaker, the bracket comprising a first opening positioned to receive a sound generated from the speaker, at least one first portion coupled to the upper case, and at least one second portion coupled to the lower case; at least one first sealing member disposed on the at least one first portion of the bracket to seal the bracket and the upper case; and a second sealing member disposed on the at least one second portion of the bracket to seal the bracket and the lower case. Selon un mode de réalisation spécifique de la présente invention, un appareil peut comprendre : un boîtier supérieur faisant face à une première direction ; un boîtier inférieur faisant face à une seconde direction opposée à la première direction, le boîtier inférieur étant couplé au boîtier supérieur pour former un espace intérieur ; et un module de haut-parleur disposé dans l'espace intérieur. Le module de haut-parleur peut comprendre : un haut-parleur ; un support entourant au moins une partie du haut-parleur, le support comprenant une première ouverture positionnée pour recevoir un son généré par le haut-parleur, au moins une première partie couplée au boîtier supérieur, et au moins une seconde partie couplée au boîtier inférieur ; au moins un premier élément d'étanchéité disposé sur la au moins une première partie du support pour sceller le support et le boîtier supérieur ; et un second élément d'étanchéité disposé sur la au moins une seconde partie du support pour sceller le support et le boîtier inférieur. 본 개시의 특정 실시예에 따르면, 장치(apparatus)는, 제1 방향을 향하는 상부 케이스; 상기 제1 방향과 반대인 제2 방향을 향하는 하부 케이스로서, 상기 상부 케이스와 결합되어 내부 공간을 형성하는 하부 케이스; 상기 내부 공간 내에 배치된 스피커 모듈을 포함하며, 상기 스피커 모듈은, 스피커; 상기 스피커의 적어도 일부를 감싸는 브라켓으로서, 상기 브라켓은, 상기 스피커로부터 발생되는 음향을 수용하도록 위치되는 제1 개구; 상기 상부 케이스와 결합되는 적어도 하나의 제1 부분; 및 상기 하부 케이스와 결합되는 적어도 하나의 제2 부분을 포함하고, 상기 브라켓의 상기 적어도 하나의 제1 부분에 배치되어 상기 브라켓과 상기 상부 케이스를 실링하는 적어도 하나의 제1 실링 부재; 및 상기 브라켓의 상기 적어도 하나의 제2 부분에 배치되어 상기 브라켓과 상기 하부 케이스를 실링하는 제2 실링 부재를 포함할 수 있다.
Author YU, Juyoung
KIM, Donghyun
PARK, Youngbae
JO, Nammin
CHO, Joonrae
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DocumentTitleAlternate 스피커 모듈의 실장 구조 및 이를 포함하는 전자 장치
STRUCTURE DE MONTAGE D'UN MODULE DE HAUT-PARLEUR ET DISPOSITIF ÉLECTRONIQUE LE COMPRENANT
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RelatedCompanies SAMSUNG ELECTRONICS CO., LTD
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Snippet According to a specific embodiment of the present disclosure, an apparatus may comprise: an upper case facing a first direction; a lower case facing a second...
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SubjectTerms DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PUBLIC ADDRESS SYSTEMS
Title SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
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