SEMICONDUCTOR MODULE

• Main Authors: KAWASE Daisuke, SASAKI Koji, ASHIDA Kisho
• Format: Patent
• Language: English; French; Japanese
• Published: 15.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Provided is a semiconductor module comprising a power semiconductor chip, the semiconductor module having a low variability in adhered position of a case made of resin and adhered to a base, and having high assembly quality and reliability enabling a decrease in stress between the case and an adhere...