CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYBRID BONDING METHOD FOR ELECTRONIC DEVICE

• Main Authors: SAITOH Takayuki, MORIWAKI Takayuki, UOMOTO Miyuki, SHIMATSU Takehito
• Format: Patent
• Language: English; French; Japanese
• Published: 18.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

According to the present invention, substrates that are bonding targets are bonded in the ambient atmosphere via bonding films, comprising oxides, formed on bonding faces of the substrates. The bonding films, which are metal or semiconductor thin films formed by vacuum film deposition and at least t...