HEATING BODY, ATOMIZATION ASSEMBLY, AND ELECTRONIC ATOMIZATION DEVICE
A heating body (11), an atomization assembly (1), and an electronic atomization device. The heating body (11) comprises a dense substrate (111) and a heating film (112). The dense substrate (111) comprises a first surface (1111), and a second surface (1112) opposite to the first surface (1111). The...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English French |
Published |
18.08.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A heating body (11), an atomization assembly (1), and an electronic atomization device. The heating body (11) comprises a dense substrate (111) and a heating film (112). The dense substrate (111) comprises a first surface (1111), and a second surface (1112) opposite to the first surface (1111). The dense substrate (111) is provided with a plurality of micropores (113). The micropores (113) are through holes, and the micropores (113) are used for guiding an aerosol-generating substrate to the first surface (1111). The heating film (112) is formed on the first surface (1111). The electrical resistance of the heating film (112) at room temperature is 0.5 ohms to 2 ohms. The thickness of the heating film (112) is 200 nanometers to 5 micrometers. The heating film (112) is made of aluminum and alloys thereof, and gold and alloys thereof. The present heating element (11) is a heating element (11) formed by a dense substrate (111), and can meet user requirements for atomization effects.
L'invention concerne un corps |
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Bibliography: | Application Number: WO2021CN104596 |