IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS
Provided is an imaging device (1) comprising: a first semiconductor substrate (100) provided with a photoelectric conversion element; a second semiconductor substrate (200) which is stacked on the first semiconductor substrate with an inter-layer insulating film (123) therebetween, and is provided w...
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Format | Patent |
Language | English French Japanese |
Published |
12.05.2022
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Abstract | Provided is an imaging device (1) comprising: a first semiconductor substrate (100) provided with a photoelectric conversion element; a second semiconductor substrate (200) which is stacked on the first semiconductor substrate with an inter-layer insulating film (123) therebetween, and is provided with a pixel circuit that reads charges generated at the photoelectric conversion element as a pixel signal; and a via (600) which passes through the inter-layer insulating film and electrically connects at least a part of a first surface of the first semiconductor substrate facing the second semiconductor substrate and a second surface of the second semiconductor substrate, the second surface facing the first surface.
L'invention concerne un dispositif d'imagerie (1), comprenant : un premier substrat semi-conducteur (100) pourvu d'un élément de conversion photoélectrique ; un second substrat semi-conducteur (200) qui est empilé sur le premier substrat semi-conducteur avec un film isolant intercalé (123) entre ceux-ci, et est pourvu d'un circuit de pixels qui lit des charges générées au niveau de l'élément de conversion photoélectrique en tant que signal de pixel ; et d'un trou d'interconnexion (600) qui passe à travers le film isolant intercalé et connecte électriquement au moins une partie d'une première surface du premier substrat semi-conducteur faisant face au second substrat semi-conducteur et une seconde surface du second substrat semi-conducteur, la seconde surface faisant face à la première surface.
光電変換素子が設けられた第1の半導体基板(100)と、前記第1の半導体基板上に層間絶縁膜(123)を介して積層され、前記光電変換素子で発生した電荷を画素信号として読み出す画素回路が設けられた第2の半導体基板(200)と、前記層間絶縁膜を貫通し、前記第2の半導体基板と対向する前記第1の半導体基板の第1の面と、前記第1の面と対向する前記第2の半導体基板の第2の面の少なくとも一部とを、電気的に接続するビア(600)とを備える、撮像装置(1)を提供する。 |
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AbstractList | Provided is an imaging device (1) comprising: a first semiconductor substrate (100) provided with a photoelectric conversion element; a second semiconductor substrate (200) which is stacked on the first semiconductor substrate with an inter-layer insulating film (123) therebetween, and is provided with a pixel circuit that reads charges generated at the photoelectric conversion element as a pixel signal; and a via (600) which passes through the inter-layer insulating film and electrically connects at least a part of a first surface of the first semiconductor substrate facing the second semiconductor substrate and a second surface of the second semiconductor substrate, the second surface facing the first surface.
L'invention concerne un dispositif d'imagerie (1), comprenant : un premier substrat semi-conducteur (100) pourvu d'un élément de conversion photoélectrique ; un second substrat semi-conducteur (200) qui est empilé sur le premier substrat semi-conducteur avec un film isolant intercalé (123) entre ceux-ci, et est pourvu d'un circuit de pixels qui lit des charges générées au niveau de l'élément de conversion photoélectrique en tant que signal de pixel ; et d'un trou d'interconnexion (600) qui passe à travers le film isolant intercalé et connecte électriquement au moins une partie d'une première surface du premier substrat semi-conducteur faisant face au second substrat semi-conducteur et une seconde surface du second substrat semi-conducteur, la seconde surface faisant face à la première surface.
光電変換素子が設けられた第1の半導体基板(100)と、前記第1の半導体基板上に層間絶縁膜(123)を介して積層され、前記光電変換素子で発生した電荷を画素信号として読み出す画素回路が設けられた第2の半導体基板(200)と、前記層間絶縁膜を貫通し、前記第2の半導体基板と対向する前記第1の半導体基板の第1の面と、前記第1の面と対向する前記第2の半導体基板の第2の面の少なくとも一部とを、電気的に接続するビア(600)とを備える、撮像装置(1)を提供する。 |
Author | FUJII, Nobutoshi HORIKOSHI, Hiroshi YOSHIOKA, Hirotaka FURUSE, Shunsuke NAKAZAWA, Keiichi MIYANAMI, Yuki OKAMOTO, Masaki MOCHIZUKI, Takeya NISHIO, Kenya YOSHIDA, Shinichi KAMATANI, Ryosuke YAMAMOTO, Yuichi HONDA, Takayoshi IZUKASHI, Kazutaka SAITO, Suguru KUROTORI, Takuya |
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DocumentTitleAlternate | 撮像装置、撮像装置の製造方法及び電子機器 DISPOSITIF D'IMAGERIE, SON PROCÉDÉ DE FABRICATION ET APPAREIL ÉLECTRONIQUE |
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Snippet | Provided is an imaging device (1) comprising: a first semiconductor substrate (100) provided with a photoelectric conversion element; a second semiconductor... |
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Title | IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS |
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