LASER PROCESSING SYSTEM AND METHOD

A laser processing system according to an embodiment of the present invention comprises: a laser unit which emits a laser beam; an optical unit which is arranged on the travel path of the laser beam to convert the laser beam incident thereto into a Bessel beam and emit the Bessel beam; a stage onto...

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Bibliographic Details
Main Authors SHIM, Sangwon, NAM, Yu Jin, YU, Sungju, HWANG, Doyeoun, CHOI, Min Hwan, RYU, Sang-gil
Format Patent
LanguageEnglish
French
Korean
Published 17.03.2022
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A laser processing system according to an embodiment of the present invention comprises: a laser unit which emits a laser beam; an optical unit which is arranged on the travel path of the laser beam to convert the laser beam incident thereto into a Bessel beam and emit the Bessel beam; a stage onto which a workpiece to be processed by the Bessel beam emitted from the optical unit is mounted; and a control unit which controls operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to locate the focal line of the Bessel beam emitted therefrom at the workpiece and move the focal line located at the workpiece in a predetermined range. Un système de traitement au laser selon un mode de réalisation de la présente invention comprend : une unité laser qui émet un faisceau laser ; une unité optique qui est agencée sur le trajet de déplacement du faisceau laser pour convertir le faisceau laser incident correspondant en un faisceau de Bessel et pour émettre le faisceau de Bessel ; une platine sur laquelle est montée une pièce devant être traitée par le faisceau de Bessel émis à partir de l'unité optique ; et une unité de commande qui commande les opérations de l'unité laser, de l'unité optique et de la platine, l'unité optique étant configurée pour localiser la ligne focale du faisceau de Bessel qu'elle émet au niveau de la pièce et pour déplacer la ligne focale située au niveau de la pièce dans une plage prédéterminée. 본 발명의 일 실시예에 따른 레이저 가공 시스템은, 레이저 빔을 방출하는 레이저 유닛; 상기 레이저 빔의 진행 경로에 배치되어 입사되는 상기 레이저 빔이 베셀 빔으로 출사시키는 광학 유닛; 상기 광학 유닛에서 출사되는 베셀 빔으로 가공하는 피가공물이 장착되는 스테이지; 및 상기 레이저 유닛, 상기 광학 유닛, 및 상기 스테이지의 작동을 제어하는 제어부;를 포함하며, 상기 광학 유닛은, 출사되는 베셀 빔의 초점 라인을 상기 피가공물에 위치시키며, 상기 피가공물에 위치된 초점 라인이 소정 범위 이동되도록 구성된다.
Bibliography:Application Number: WO2021KR04300