LIGHT-EMITTING DIODE EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR
Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking lay...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English French |
Published |
17.03.2022
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Abstract | Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking layer and a p-type GaN layer which are sequentially stacked on the substrate, wherein a plurality of hole injection grooves distributed at intervals are provided on the p-type GaN layer, and each of the hole injection grooves extends from the p-type GaN layer to the multi-quantum well layer; and the light-emitting diode epitaxial wafer further comprises a plurality of GaN hole injection structures, and the plurality of GaN hole injection structures are distributed in the plurality of hole injection grooves in a one-to-one correspondence.
La présente invention concerne une tranche épitaxiale de diode électroluminescente et son procédé de préparation, qui se rapportent au domaine de la fabrication de diodes électrolumin |
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AbstractList | Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking layer and a p-type GaN layer which are sequentially stacked on the substrate, wherein a plurality of hole injection grooves distributed at intervals are provided on the p-type GaN layer, and each of the hole injection grooves extends from the p-type GaN layer to the multi-quantum well layer; and the light-emitting diode epitaxial wafer further comprises a plurality of GaN hole injection structures, and the plurality of GaN hole injection structures are distributed in the plurality of hole injection grooves in a one-to-one correspondence.
La présente invention concerne une tranche épitaxiale de diode électroluminescente et son procédé de préparation, qui se rapportent au domaine de la fabrication de diodes électrolumin |
Author | HONG, Weiwei MEI, Jing WANG, Qian DONG, Binzhong ZHANG, Yi |
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DocumentTitleAlternate | TRANCHE ÉPITAXIALE DE DIODE ÉLECTROLUMINESCENTE ET SON PROCÉDÉ DE PRÉPARATION 发光二极管外延片及其制备方法 |
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Snippet | Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | LIGHT-EMITTING DIODE EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR |
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