LIGHT-EMITTING DIODE EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR

Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking lay...

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Main Authors MEI, Jing, DONG, Binzhong, WANG, Qian, HONG, Weiwei, ZHANG, Yi
Format Patent
LanguageChinese
English
French
Published 17.03.2022
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Abstract Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking layer and a p-type GaN layer which are sequentially stacked on the substrate, wherein a plurality of hole injection grooves distributed at intervals are provided on the p-type GaN layer, and each of the hole injection grooves extends from the p-type GaN layer to the multi-quantum well layer; and the light-emitting diode epitaxial wafer further comprises a plurality of GaN hole injection structures, and the plurality of GaN hole injection structures are distributed in the plurality of hole injection grooves in a one-to-one correspondence. La présente invention concerne une tranche épitaxiale de diode électroluminescente et son procédé de préparation, qui se rapportent au domaine de la fabrication de diodes électrolumin
AbstractList Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking layer and a p-type GaN layer which are sequentially stacked on the substrate, wherein a plurality of hole injection grooves distributed at intervals are provided on the p-type GaN layer, and each of the hole injection grooves extends from the p-type GaN layer to the multi-quantum well layer; and the light-emitting diode epitaxial wafer further comprises a plurality of GaN hole injection structures, and the plurality of GaN hole injection structures are distributed in the plurality of hole injection grooves in a one-to-one correspondence. La présente invention concerne une tranche épitaxiale de diode électroluminescente et son procédé de préparation, qui se rapportent au domaine de la fabrication de diodes électrolumin
Author HONG, Weiwei
MEI, Jing
WANG, Qian
DONG, Binzhong
ZHANG, Yi
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DocumentTitleAlternate TRANCHE ÉPITAXIALE DE DIODE ÉLECTROLUMINESCENTE ET SON PROCÉDÉ DE PRÉPARATION
发光二极管外延片及其制备方法
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Snippet Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The...
SourceID epo
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title LIGHT-EMITTING DIODE EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR
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