LIGHT-EMITTING DIODE EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR

Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking lay...

Full description

Saved in:
Bibliographic Details
Main Authors MEI, Jing, DONG, Binzhong, WANG, Qian, HONG, Weiwei, ZHANG, Yi
Format Patent
LanguageChinese
English
French
Published 17.03.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Disclosed are a light-emitting diode epitaxial wafer and a preparation method therefor, which belong to the field of light-emitting diode manufacturing. The light-emitting diode epitaxial wafer comprises a substrate, and an n-type GaN layer, a multi-quantum well layer, an AlGaN electron blocking layer and a p-type GaN layer which are sequentially stacked on the substrate, wherein a plurality of hole injection grooves distributed at intervals are provided on the p-type GaN layer, and each of the hole injection grooves extends from the p-type GaN layer to the multi-quantum well layer; and the light-emitting diode epitaxial wafer further comprises a plurality of GaN hole injection structures, and the plurality of GaN hole injection structures are distributed in the plurality of hole injection grooves in a one-to-one correspondence. La présente invention concerne une tranche épitaxiale de diode électroluminescente et son procédé de préparation, qui se rapportent au domaine de la fabrication de diodes électrolumin
Bibliography:Application Number: WO2021CN117073