THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME

• Main Authors: PICHA, Kyle C, PEREZ, Mario A, LARSEN, Jeremy K, FREY, Matthew H, JOHNSON, Matthew T, PODKAMINER, Jacob P, HO, Victor, LINDSAY, Craig W
• Format: Patent
• Language: English; French
• Published: 03.02.2022
• Subjects: ADHESIVES; ARTIFICIAL STONE; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; DYES; LIME, MAGNESIA; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; REFRACTORIES; SLAG; THEIR PREPARATION OR CHEMICAL WORKING-UP; TREATMENT OF NATURAL STONE; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The sh...