THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The sh...
Saved in:
Main Authors | , , , , , , , |
---|---|
Format | Patent |
Language | English French |
Published |
03.02.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
L'invention concerne une particule de renfort thermique façonnée qui a une forme allongée définie par une première surface lisse sensiblement plane et une seconde surface lisse qui est en contact avec la première surface lisse sensiblement plane le long d'un chemin plan fermé. Le chemin plan fermé présente un rapport de sa longueur à sa largeur d'au moins 1,5. La particule de renfort thermique façonnée a une dimension linéaire maximale normale à la première surface lisse plane qui est inférieure ou égale à la moitié de la longueur du chemin fermé. Une composition thermoconductrice comprend de 1 à 95 % en volume des particules de renfort thermique façonnées dispersées dans un liant. Un ensemble comprend une source de chaleur, un puits thermique et la composition thermoconductrice au moins partiellement intercalée entre la source de chaleur et le puits thermique. |
---|---|
AbstractList | A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
L'invention concerne une particule de renfort thermique façonnée qui a une forme allongée définie par une première surface lisse sensiblement plane et une seconde surface lisse qui est en contact avec la première surface lisse sensiblement plane le long d'un chemin plan fermé. Le chemin plan fermé présente un rapport de sa longueur à sa largeur d'au moins 1,5. La particule de renfort thermique façonnée a une dimension linéaire maximale normale à la première surface lisse plane qui est inférieure ou égale à la moitié de la longueur du chemin fermé. Une composition thermoconductrice comprend de 1 à 95 % en volume des particules de renfort thermique façonnées dispersées dans un liant. Un ensemble comprend une source de chaleur, un puits thermique et la composition thermoconductrice au moins partiellement intercalée entre la source de chaleur et le puits thermique. |
Author | PODKAMINER, Jacob P FREY, Matthew H LARSEN, Jeremy K LINDSAY, Craig W HO, Victor PEREZ, Mario A JOHNSON, Matthew T PICHA, Kyle C |
Author_xml | – fullname: PICHA, Kyle C – fullname: PEREZ, Mario A – fullname: LARSEN, Jeremy K – fullname: FREY, Matthew H – fullname: JOHNSON, Matthew T – fullname: PODKAMINER, Jacob P – fullname: HO, Victor – fullname: LINDSAY, Craig W |
BookMark | eNrjYmDJy89L5WSICvFwDfJ19FFw8_TxcQ1SCHAMCvF09nHVUYBK-EQqOPv7uYQ6h3iGuQKZvgH-wZ4hnv5-OgqOfi4KjsHBrr5OQEWefs4-oS6efu4gjQrBjr6uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPtzfyMAIiIwtDQwcDY2JUwUAZ2k0Xw |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | PARTICULE DE RENFORT THERMIQUE, COMPOSITION THERMOCONDUCTRICE ET ENSEMBLE LA CONTENANT |
ExternalDocumentID | WO2022023900A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_WO2022023900A13 |
IEDL.DBID | EVB |
IngestDate | Fri Sep 27 05:23:25 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_WO2022023900A13 |
Notes | Application Number: WO2021IB56644 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&CC=WO&NR=2022023900A1 |
ParticipantIDs | epo_espacenet_WO2022023900A1 |
PublicationCentury | 2000 |
PublicationDate | 20220203 |
PublicationDateYYYYMMDD | 2022-02-03 |
PublicationDate_xml | – month: 02 year: 2022 text: 20220203 day: 03 |
PublicationDecade | 2020 |
PublicationYear | 2022 |
RelatedCompanies | 3M INNOVATIVE PROPERTIES COMPANY |
RelatedCompanies_xml | – name: 3M INNOVATIVE PROPERTIES COMPANY |
Score | 3.3777535 |
Snippet | A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADHESIVES ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DYES LIME, MAGNESIA MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES REFRACTORIES SLAG THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF NATURAL STONE USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
Title | THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&locale=&CC=WO&NR=2022023900A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOqbosYPNE00e2IR2MbggZjRdW5mX9kGIi-EfZCYmEFkxn_f6zKUJ_rU9tpLe8m192t7V4BHdZF2pEVfEaVYikU56yzF_qAji6mSLGNck6W0y32HHbdnjuXXqTKtwefWF6aME_pTBkdEjUpQ34tyvV7_H2Lp5dvKzVP8gVWrZyMa6kKFjrtdfrEm6KMh8z3dowKliNsEN6hoCPDbGmKlAzSkVa4PbDLifinr3U3FOIVDH_nlxRnUsrwBx3T791oDjpzqyhuzlfZtzmEWmSxwNJsYCMFZQHw0Ri1qsxapCPY7oZ6rj2lkTRhmHd8LLX4G1SKaqxMtDJkzwkaI5G00BN0X3pGEmsMu4MFgETVFHOT8TybzN293RtIl1PNVnl0BSQZtFG8SI3LD1E4WGdpMKo-Sk6Y9rL6G5j5ON_vJt3DCi-WzZakJ9eLrO7vDXbmI70th_gJwVIjD |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQGlTytu6z4fhnRpaqtNW9ZuTl9GvwaCdMNV_Pe9lE73tDyFXBKSg_v4JbkLwH0viJtK0O_ISqiEcjtpLuT-oNmW4060CFEnK3FLxA5zu2tM2s-zzqwEn5tYmDxP6E-eHBElKkJ5z3J9vfo_xNLyt5Xrh_ADm5aPuj_UpAIdt1riYk3SRkPmOppDJUoRt0n2uKAhwG-oiJX20MnuCXlg05GIS1ltGxX9CPZdnC_NjqGUpFWo0M3fa1U44MWVN1YL6VufwLtvsDFXLaIjBGdj4qIzalKL1UlBsN4IdWxtQn1zyrDKXcczxRlUnai2RlTPY3yEnRDJW-gI2k9iIPFUzk7hTmc-NWRc5PyPJ_NXZ3tHyhmU02WanAOJBg1kbxQicsPSiIIEfaaeyJITx11svoDarpkud5NvoWL43Jpbpv1yBYeClD9hVmpQzr6-k2u00Fl4kzP2Fwdgi7Y |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=THERMAL+FILLER+PARTICLE%2C+THERMALLY+CONDUCTIVE+COMPOSITION%2C+AND+ASSEMBLY+INCLUDING+THE+SAME&rft.inventor=PICHA%2C+Kyle+C&rft.inventor=PEREZ%2C+Mario+A&rft.inventor=LARSEN%2C+Jeremy+K&rft.inventor=FREY%2C+Matthew+H&rft.inventor=JOHNSON%2C+Matthew+T&rft.inventor=PODKAMINER%2C+Jacob+P&rft.inventor=HO%2C+Victor&rft.inventor=LINDSAY%2C+Craig+W&rft.date=2022-02-03&rft.externalDBID=A1&rft.externalDocID=WO2022023900A1 |