THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME

A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The sh...

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Main Authors PICHA, Kyle C, PEREZ, Mario A, LARSEN, Jeremy K, FREY, Matthew H, JOHNSON, Matthew T, PODKAMINER, Jacob P, HO, Victor, LINDSAY, Craig W
Format Patent
LanguageEnglish
French
Published 03.02.2022
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Abstract A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink. L'invention concerne une particule de renfort thermique façonnée qui a une forme allongée définie par une première surface lisse sensiblement plane et une seconde surface lisse qui est en contact avec la première surface lisse sensiblement plane le long d'un chemin plan fermé. Le chemin plan fermé présente un rapport de sa longueur à sa largeur d'au moins 1,5. La particule de renfort thermique façonnée a une dimension linéaire maximale normale à la première surface lisse plane qui est inférieure ou égale à la moitié de la longueur du chemin fermé. Une composition thermoconductrice comprend de 1 à 95 % en volume des particules de renfort thermique façonnées dispersées dans un liant. Un ensemble comprend une source de chaleur, un puits thermique et la composition thermoconductrice au moins partiellement intercalée entre la source de chaleur et le puits thermique.
AbstractList A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink. L'invention concerne une particule de renfort thermique façonnée qui a une forme allongée définie par une première surface lisse sensiblement plane et une seconde surface lisse qui est en contact avec la première surface lisse sensiblement plane le long d'un chemin plan fermé. Le chemin plan fermé présente un rapport de sa longueur à sa largeur d'au moins 1,5. La particule de renfort thermique façonnée a une dimension linéaire maximale normale à la première surface lisse plane qui est inférieure ou égale à la moitié de la longueur du chemin fermé. Une composition thermoconductrice comprend de 1 à 95 % en volume des particules de renfort thermique façonnées dispersées dans un liant. Un ensemble comprend une source de chaleur, un puits thermique et la composition thermoconductrice au moins partiellement intercalée entre la source de chaleur et le puits thermique.
Author PODKAMINER, Jacob P
FREY, Matthew H
LARSEN, Jeremy K
LINDSAY, Craig W
HO, Victor
PEREZ, Mario A
JOHNSON, Matthew T
PICHA, Kyle C
Author_xml – fullname: PICHA, Kyle C
– fullname: PEREZ, Mario A
– fullname: LARSEN, Jeremy K
– fullname: FREY, Matthew H
– fullname: JOHNSON, Matthew T
– fullname: PODKAMINER, Jacob P
– fullname: HO, Victor
– fullname: LINDSAY, Craig W
BookMark eNrjYmDJy89L5WSICvFwDfJ19FFw8_TxcQ1SCHAMCvF09nHVUYBK-EQqOPv7uYQ6h3iGuQKZvgH-wZ4hnv5-OgqOfi4KjsHBrr5OQEWefs4-oS6efu4gjQrBjr6uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPtzfyMAIiIwtDQwcDY2JUwUAZ2k0Xw
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate PARTICULE DE RENFORT THERMIQUE, COMPOSITION THERMOCONDUCTRICE ET ENSEMBLE LA CONTENANT
ExternalDocumentID WO2022023900A1
GroupedDBID EVB
ID FETCH-epo_espacenet_WO2022023900A13
IEDL.DBID EVB
IngestDate Fri Sep 27 05:23:25 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
French
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_WO2022023900A13
Notes Application Number: WO2021IB56644
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&CC=WO&NR=2022023900A1
ParticipantIDs epo_espacenet_WO2022023900A1
PublicationCentury 2000
PublicationDate 20220203
PublicationDateYYYYMMDD 2022-02-03
PublicationDate_xml – month: 02
  year: 2022
  text: 20220203
  day: 03
PublicationDecade 2020
PublicationYear 2022
RelatedCompanies 3M INNOVATIVE PROPERTIES COMPANY
RelatedCompanies_xml – name: 3M INNOVATIVE PROPERTIES COMPANY
Score 3.3777535
Snippet A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the...
SourceID epo
SourceType Open Access Repository
SubjectTerms ADHESIVES
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
DYES
LIME, MAGNESIA
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
REFRACTORIES
SLAG
THEIR PREPARATION OR CHEMICAL WORKING-UP
TREATMENT OF NATURAL STONE
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Title THERMAL FILLER PARTICLE, THERMALLY CONDUCTIVE COMPOSITION, AND ASSEMBLY INCLUDING THE SAME
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&locale=&CC=WO&NR=2022023900A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOqbosYPNE00e2IR2MbggZjRdW5mX9kGIi-EfZCYmEFkxn_f6zKUJ_rU9tpLe8m192t7V4BHdZF2pEVfEaVYikU56yzF_qAji6mSLGNck6W0y32HHbdnjuXXqTKtwefWF6aME_pTBkdEjUpQ34tyvV7_H2Lp5dvKzVP8gVWrZyMa6kKFjrtdfrEm6KMh8z3dowKliNsEN6hoCPDbGmKlAzSkVa4PbDLifinr3U3FOIVDH_nlxRnUsrwBx3T791oDjpzqyhuzlfZtzmEWmSxwNJsYCMFZQHw0Ri1qsxapCPY7oZ6rj2lkTRhmHd8LLX4G1SKaqxMtDJkzwkaI5G00BN0X3pGEmsMu4MFgETVFHOT8TybzN293RtIl1PNVnl0BSQZtFG8SI3LD1E4WGdpMKo-Sk6Y9rL6G5j5ON_vJt3DCi-WzZakJ9eLrO7vDXbmI70th_gJwVIjD
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQGlTytu6z4fhnRpaqtNW9ZuTl9GvwaCdMNV_Pe9lE73tDyFXBKSg_v4JbkLwH0viJtK0O_ISqiEcjtpLuT-oNmW4060CFEnK3FLxA5zu2tM2s-zzqwEn5tYmDxP6E-eHBElKkJ5z3J9vfo_xNLyt5Xrh_ADm5aPuj_UpAIdt1riYk3SRkPmOppDJUoRt0n2uKAhwG-oiJX20MnuCXlg05GIS1ltGxX9CPZdnC_NjqGUpFWo0M3fa1U44MWVN1YL6VufwLtvsDFXLaIjBGdj4qIzalKL1UlBsN4IdWxtQn1zyrDKXcczxRlUnai2RlTPY3yEnRDJW-gI2k9iIPFUzk7hTmc-NWRc5PyPJ_NXZ3tHyhmU02WanAOJBg1kbxQicsPSiIIEfaaeyJITx11svoDarpkud5NvoWL43Jpbpv1yBYeClD9hVmpQzr6-k2u00Fl4kzP2Fwdgi7Y
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=THERMAL+FILLER+PARTICLE%2C+THERMALLY+CONDUCTIVE+COMPOSITION%2C+AND+ASSEMBLY+INCLUDING+THE+SAME&rft.inventor=PICHA%2C+Kyle+C&rft.inventor=PEREZ%2C+Mario+A&rft.inventor=LARSEN%2C+Jeremy+K&rft.inventor=FREY%2C+Matthew+H&rft.inventor=JOHNSON%2C+Matthew+T&rft.inventor=PODKAMINER%2C+Jacob+P&rft.inventor=HO%2C+Victor&rft.inventor=LINDSAY%2C+Craig+W&rft.date=2022-02-03&rft.externalDBID=A1&rft.externalDocID=WO2022023900A1