COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

• Main Authors: NAKAKO Hideo, SUGAMA Chie, NEGISHI Motohiro, NATORI Michiko, ISHIKAWA Dai, KAWANA Yuki
• Format: Patent
• Language: English; French; Japanese
• Published: 08.04.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING METALLIC POWDER

This copper paste for joining contains metal particles and a dispersion medium, wherein the metal particles include copper particles, and the dispersion medium includes dihydroterpineol. This method for manufacturing a joined body involves manufacturing a joined body provided with a first member, a...