FLIP CHIP LASER BONDING SYSTEM

• Main Authors: KO, Youn Sung, AHN, Geun Sik
• Format: Patent
• Language: English; French; Korean
• Published: 12.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a flip chip laser bonding system and, more specifically, to a flip chip laser bonding system for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam. The flip chip laser bonding system according to the present invention laser-bonds the semiconductor chip to a substrate while pressing same, thereby enabling even the semiconductor chip that is bent or is likely to bend to be bonded to the substrate without the contact failure of solder bumps. La présente invention concerne un système de soudage laser de puce retournée et, plus précisément, un système de soudage laser de puce retournée destiné à souder une puce de semi-conducteur du type puce retournée à un substrat à l'aide d'un faisceau laser. Le système de soudage laser de puce retournée selon la présente invention soude au laser la puce de semi-conducteur à un substrat tout en la pressant, ce qui permet de souder au substrat une puce de semi-conducteur même courbée ou susceptible de se courber, sans le défaut de collage de perles de soudure. 본 발명은 플립칩 레이저 본딩 시스템 및 플립칩 레이저 본딩 시스템에 관한 것으로서, 더욱 상세하게는 플립칩 형태의 반도체 칩을 레이저 빔을 이용하여 기판에 본딩하는 플립칩 레이저 본딩 시스템에 관한 것이다. 본 발명에 의한 플립칩 레이저 본딩 시스템은 반도체 칩을 가압한 상태로 기판에 레이저 본딩함으로써 휘어져 있거나 휘어질 수 있는 반도체 칩도 솔더 범프의 접촉 불량 없이 기판에 본딩할 수 있는 효과가 있다.