MANUFACTURING METHOD FOR CONDUCTOR-FILLED THROUGH-HOLE SUBSTRATE AND CONDUCTOR-FILLED THROUGH-HOLE SUBSTRATE

• Main Authors: NAKAKO Hideo, EJIRI Yoshinori, YONEKURA Motoki, SUKATA Shinichirou, ISHII Manabu, NATORI Michiko, KIMURA Masahiro, FUJITA Masaru, HONNA Ryo, KAWANA Yuki
• Format: Patent
• Language: English; French; Japanese
• Published: 29.10.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A manufacturing method for a conductor-filled through-hole substrate according to one embodiment comprises: a preparation step for preparing a through-hole substrate including an insulating base having through-holes disposed therein, the through-holes communicating with both main surfaces; a copper...