FILM FORMING DEVICE
The present application discloses a film forming device that includes: a vacuum container; a substrate holder that is located inside the vacuum container and that has a substrate holding surface for holding a substrate; a film forming means that is located inside the vacuum chamber and is for formin...
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Main Authors | , , , |
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Format | Patent |
Language | English French Japanese |
Published |
23.04.2020
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Abstract | The present application discloses a film forming device that includes: a vacuum container; a substrate holder that is located inside the vacuum container and that has a substrate holding surface for holding a substrate; a film forming means that is located inside the vacuum chamber and is for forming a thin-film on the substrate; and an irradiating means that is located inside the vacuum chamber and is for emitting particles toward the substrate holder, wherein the electric potential state of the substrate holding surface becomes one of a single electric potential due to the irradiating means. The film forming device provided in the present application suppresses the generation of abnormal discharge in a film forming process, ensures stability of a thin-film forming process, and improves film formation quality.
La présente invention concerne un dispositif de formation de film, qui comprend : un récipient sous vide ; un dispositif de support de substrat qui est situé à l'intérieur du récipient sous vide et qui a une surface de support de substrat pour le support d'un substrat ; un moyen de formation de film qui est situé à l'intérieur de la chambre à vide et qui sert à former un film mince sur le substrat ; et un moyen d'exposition à des particules qui est situé à l'intérieur de la chambre à vide et qui sert à émettre des particules en direction du support de substrat, l'état de potentiel électrique de la surface de support de substrat devenant un potentiel électrique unique en raison du moyen d'exposition à des particules. Le dispositif de formation de film selon la présente invention supprime la production d'une décharge anormale dans un processus de formation de film, assure la stabilité d'un processus de formation de film mince et améliore la qualité de formation de film.
本願は、真空容器と、前記真空容器内に位置する、基板を保持するための基板保持面を有する基板ホルダと、前記真空容器内に位置する、前記基板に薄膜を形成するための成膜手段と、前記真空容器内に位置する、前記基板ホルダへ粒子を放射するための照射手段と、を含み、前記照射手段により前記基板保持面の電位状態が単一電位になる成膜装置を開示している。本願に提供される成膜装置は成膜過程で異常放電の発生を抑制し、薄膜形成過程の安定性を保証し、成膜品質を向上する。 |
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AbstractList | The present application discloses a film forming device that includes: a vacuum container; a substrate holder that is located inside the vacuum container and that has a substrate holding surface for holding a substrate; a film forming means that is located inside the vacuum chamber and is for forming a thin-film on the substrate; and an irradiating means that is located inside the vacuum chamber and is for emitting particles toward the substrate holder, wherein the electric potential state of the substrate holding surface becomes one of a single electric potential due to the irradiating means. The film forming device provided in the present application suppresses the generation of abnormal discharge in a film forming process, ensures stability of a thin-film forming process, and improves film formation quality.
La présente invention concerne un dispositif de formation de film, qui comprend : un récipient sous vide ; un dispositif de support de substrat qui est situé à l'intérieur du récipient sous vide et qui a une surface de support de substrat pour le support d'un substrat ; un moyen de formation de film qui est situé à l'intérieur de la chambre à vide et qui sert à former un film mince sur le substrat ; et un moyen d'exposition à des particules qui est situé à l'intérieur de la chambre à vide et qui sert à émettre des particules en direction du support de substrat, l'état de potentiel électrique de la surface de support de substrat devenant un potentiel électrique unique en raison du moyen d'exposition à des particules. Le dispositif de formation de film selon la présente invention supprime la production d'une décharge anormale dans un processus de formation de film, assure la stabilité d'un processus de formation de film mince et améliore la qualité de formation de film.
本願は、真空容器と、前記真空容器内に位置する、基板を保持するための基板保持面を有する基板ホルダと、前記真空容器内に位置する、前記基板に薄膜を形成するための成膜手段と、前記真空容器内に位置する、前記基板ホルダへ粒子を放射するための照射手段と、を含み、前記照射手段により前記基板保持面の電位状態が単一電位になる成膜装置を開示している。本願に提供される成膜装置は成膜過程で異常放電の発生を抑制し、薄膜形成過程の安定性を保証し、成膜品質を向上する。 |
Author | NAGAE, Ekishu YIN, Shiliu MIYAUCHI, Mitsuhiro Ma, Tuteng |
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DocumentTitleAlternate | DISPOSITIF DE FORMATION DE FILM 成膜装置 |
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Notes | Application Number: WO2019JP39685 |
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RelatedCompanies | SHINCRON CO., LTD |
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Snippet | The present application discloses a film forming device that includes: a vacuum container; a substrate holder that is located inside the vacuum container and... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | FILM FORMING DEVICE |
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