COIL DEVICE AND METHOD FOR MANUFACTURING SAME
Provided is a coil device which can minimize the occurrence of defects and increase the thickness of a conductor pattern. The coil device comprises: a base substrate; a seed pattern which is formed on the base substrate and includes a seed area and an introduction wire area; a first conductive patte...
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Format | Patent |
Language | English French Korean |
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09.01.2020
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Abstract | Provided is a coil device which can minimize the occurrence of defects and increase the thickness of a conductor pattern. The coil device comprises: a base substrate; a seed pattern which is formed on the base substrate and includes a seed area and an introduction wire area; a first conductive pattern formed on the seed area; a second conductive pattern formed on at least a part of the first conductive pattern; and a protective layer formed to be in contact with at least one among the base substrate, the seed pattern, the first conductive pattern, and the second conductive pattern, wherein the seed pattern of the introduction wire area extends up to a cut line.
La présente invention concerne un dispositif de bobine qui peut réduire à un minimum l'apparition de défauts et augmenter l'épaisseur d'un motif conducteur. Le dispositif de bobine comprend : un substrat de base ; un motif de germe qui est formé sur le substrat de base et comprend une zone de germe et une zone de fil d'introduction ; un premier motif conducteur formé sur la zone de germe ; un second motif conducteur formé sur au moins une partie du premier motif conducteur ; et une couche de protection formée de sorte à être en contact avec le substrat de base et/ou le motif de germe et/ou le premier motif conducteur et/ou le second motif conducteur, le motif de germe de la zone de fil d'introduction s'étendant jusqu'à une ligne de coupe.
불량을 최소화하며 도체 패턴의 두께를 증가시킬 수 있는 코일 장치를 제공된다. 상기 코일 장치는 베이스 기재; 상기 베이스 기재 상에 형성되고, 씨드 영역과 인입 배선 영역을 포함하는 씨드 패턴; 상기 씨드 영역 상에 형성되는 제1 도전 패턴; 상기 제1 도전 패턴의 적어도 일부에 형성되는 제2 도전 패턴; 및 상기 베이스 기재, 씨드 패턴, 제1 도전 패턴 및 제2 도전 패턴 중 적어도 어느 하나 이상과 접하도록 형성되는 보호층을 포함하되, 상기 인입 배선 영역의 씨드 패턴은 컷라인까지 연장된다. |
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AbstractList | Provided is a coil device which can minimize the occurrence of defects and increase the thickness of a conductor pattern. The coil device comprises: a base substrate; a seed pattern which is formed on the base substrate and includes a seed area and an introduction wire area; a first conductive pattern formed on the seed area; a second conductive pattern formed on at least a part of the first conductive pattern; and a protective layer formed to be in contact with at least one among the base substrate, the seed pattern, the first conductive pattern, and the second conductive pattern, wherein the seed pattern of the introduction wire area extends up to a cut line.
La présente invention concerne un dispositif de bobine qui peut réduire à un minimum l'apparition de défauts et augmenter l'épaisseur d'un motif conducteur. Le dispositif de bobine comprend : un substrat de base ; un motif de germe qui est formé sur le substrat de base et comprend une zone de germe et une zone de fil d'introduction ; un premier motif conducteur formé sur la zone de germe ; un second motif conducteur formé sur au moins une partie du premier motif conducteur ; et une couche de protection formée de sorte à être en contact avec le substrat de base et/ou le motif de germe et/ou le premier motif conducteur et/ou le second motif conducteur, le motif de germe de la zone de fil d'introduction s'étendant jusqu'à une ligne de coupe.
불량을 최소화하며 도체 패턴의 두께를 증가시킬 수 있는 코일 장치를 제공된다. 상기 코일 장치는 베이스 기재; 상기 베이스 기재 상에 형성되고, 씨드 영역과 인입 배선 영역을 포함하는 씨드 패턴; 상기 씨드 영역 상에 형성되는 제1 도전 패턴; 상기 제1 도전 패턴의 적어도 일부에 형성되는 제2 도전 패턴; 및 상기 베이스 기재, 씨드 패턴, 제1 도전 패턴 및 제2 도전 패턴 중 적어도 어느 하나 이상과 접하도록 형성되는 보호층을 포함하되, 상기 인입 배선 영역의 씨드 패턴은 컷라인까지 연장된다. |
Author | KIM, Young Jun SHIN, Su Jeong HAN, Chang Hoon KIM, Dong Gon |
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DocumentTitleAlternate | 코일 장치 및 그 제조 방법 DISPOSITIF DE BOBINE ET SON PROCÉDÉ DE FABRICATION |
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Snippet | Provided is a coil device which can minimize the occurrence of defects and increase the thickness of a conductor pattern. The coil device comprises: a base... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS |
Title | COIL DEVICE AND METHOD FOR MANUFACTURING SAME |
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