LIGHT-EMITTING DIODE PACKAGES

Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward...

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Main Authors MURTHY, Roshan, SHI, Xiameng, DAVIS, Kenneth, PARK, Jae-Hyung
Format Patent
LanguageEnglish
French
Published 28.11.2019
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Abstract Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination. L'invention concerne des dispositifs électroluminescents à semi-conducteurs comprenant des diodes électroluminescentes (DEL), et plus particulièrement des DEL encapsulées. Dans certains modes de réalisation, un boîtier de DEL comprend des connexions électriques qui sont configurées pour réduire la corrosion de métaux à l'intérieur du boîtier de DEL ; ou diminuer la tension directe globale du boîtier de DEL ; ou fournir un trajet électrique pour des puces à décharge électrostatique connectées en série (ESD). Dans certains modes de réalisation, un boîtier de DEL comprend au moins deux puces de DEL et un matériau entre les deux puces de DEL qui favorise l'homogénéité des émissions composites provenant des deux puces de DEL. De cette manière, les boîtiers de DEL selon la présente invention peuvent être avantageux pour diverses applications, y compris celles où une intensité lumineuse élevée est souhaitée dans diverses conditions environnementales. De telles applications comprennent l'éclairage automobile, l'éclairage aérospatial et l'éclairage général.
AbstractList Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination. L'invention concerne des dispositifs électroluminescents à semi-conducteurs comprenant des diodes électroluminescentes (DEL), et plus particulièrement des DEL encapsulées. Dans certains modes de réalisation, un boîtier de DEL comprend des connexions électriques qui sont configurées pour réduire la corrosion de métaux à l'intérieur du boîtier de DEL ; ou diminuer la tension directe globale du boîtier de DEL ; ou fournir un trajet électrique pour des puces à décharge électrostatique connectées en série (ESD). Dans certains modes de réalisation, un boîtier de DEL comprend au moins deux puces de DEL et un matériau entre les deux puces de DEL qui favorise l'homogénéité des émissions composites provenant des deux puces de DEL. De cette manière, les boîtiers de DEL selon la présente invention peuvent être avantageux pour diverses applications, y compris celles où une intensité lumineuse élevée est souhaitée dans diverses conditions environnementales. De telles applications comprennent l'éclairage automobile, l'éclairage aérospatial et l'éclairage général.
Author DAVIS, Kenneth
SHI, Xiameng
PARK, Jae-Hyung
MURTHY, Roshan
Author_xml – fullname: MURTHY, Roshan
– fullname: SHI, Xiameng
– fullname: DAVIS, Kenneth
– fullname: PARK, Jae-Hyung
BookMark eNrjYmDJy89L5WSQ9fF09wjRdfX1DAnx9HNXcPH0d3FVCHB09nZ0dw3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBoaWRkZmQOhoaEycKgDnIyOc
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate BOÎTIERS DE DIODE ÉLECTROLUMINESCENTE
ExternalDocumentID WO2019226262A1
GroupedDBID EVB
ID FETCH-epo_espacenet_WO2019226262A13
IEDL.DBID EVB
IngestDate Fri Jul 19 12:45:45 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
French
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_WO2019226262A13
Notes Application Number: WO2019US28704
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191128&DB=EPODOC&CC=WO&NR=2019226262A1
ParticipantIDs epo_espacenet_WO2019226262A1
PublicationCentury 2000
PublicationDate 20191128
PublicationDateYYYYMMDD 2019-11-28
PublicationDate_xml – month: 11
  year: 2019
  text: 20191128
  day: 28
PublicationDecade 2010
PublicationYear 2019
RelatedCompanies CREE, INC
RelatedCompanies_xml – name: CREE, INC
Score 3.2327423
Snippet Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title LIGHT-EMITTING DIODE PACKAGES
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191128&DB=EPODOC&locale=&CC=WO&NR=2019226262A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMU5OTE5LSjTXNUwxTdE1MU000k0C1qO6wMZFkqGJqUFyigloN7Kvn5lHqIlXhGkEE0MObC8M-JzQcvDhiMAclQzM7yXg8roAMYjlAl5bWayflAkUyrd3C7F1UYP2joGdD2B5q-biZOsa4O_i76zm7Azst6n5BYHlgC0NIHQE9pVYgQ1pc1B-cA1zAu1LKUCuVNwEGdgCgObllQgxMKXmCTNwOsPuXhNm4PCFTnkDmdDcVyzCIOvj6e4RogsMuZAQTz93BRdPfxdXhQBHZ29Hd9dgUQZlN9cQZw9doD3xcG_Fh_sjO8pYjIEF2OFPlWBQSLNMMjMxTTUCBi8wuIyTEk0tTYHNgNS0xLSURKNkA0kGGXwmSeGXlmbgAnFB--mMLGQYWEqKSlNlgRVrSZIcODwA4Jh4XQ
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq2K11YCS22KbZGt7KJJunjaPolF7C9k8QJBabMS_72RJtaeyl2UH9jEwj293ZwbgVk2TtODJPRlkNCMaTRTC0Y4SdC74QKP9NNOqaGQ_GDov2uOCLhrwsYmFEXlCf0RyRJSoFOW9FPp69X-JZYi_les7_o5Dnw9WNDHkGh0j-EB9KxvTiTkPjZDJjCFuk4MnQUNPA5uOWGkPnexRVe_AfJ1WcSmrbaNiHcH-HOdblsfQyJdtaLFN7bU2HPj1kzd2a-lbn0DPc20nIsi5KHIDWzLc0DCluc5mum0-n8KNZUbMIbhO_Hes-C3c3pR6Bk0E_Pk5SMWYDzWaK8heZJfKEzqm6AbkRVJkiZL2O9DdNdPFbvI1tJzI92LPDWaXcFiRqtg6ZdSFZvn1nffQyJb8SvDmF6yke00
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=LIGHT-EMITTING+DIODE+PACKAGES&rft.inventor=MURTHY%2C+Roshan&rft.inventor=SHI%2C+Xiameng&rft.inventor=DAVIS%2C+Kenneth&rft.inventor=PARK%2C+Jae-Hyung&rft.date=2019-11-28&rft.externalDBID=A1&rft.externalDocID=WO2019226262A1