LIGHT-EMITTING DIODE PACKAGES
Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward...
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Format | Patent |
Language | English French |
Published |
28.11.2019
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Abstract | Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.
L'invention concerne des dispositifs électroluminescents à semi-conducteurs comprenant des diodes électroluminescentes (DEL), et plus particulièrement des DEL encapsulées. Dans certains modes de réalisation, un boîtier de DEL comprend des connexions électriques qui sont configurées pour réduire la corrosion de métaux à l'intérieur du boîtier de DEL ; ou diminuer la tension directe globale du boîtier de DEL ; ou fournir un trajet électrique pour des puces à décharge électrostatique connectées en série (ESD). Dans certains modes de réalisation, un boîtier de DEL comprend au moins deux puces de DEL et un matériau entre les deux puces de DEL qui favorise l'homogénéité des émissions composites provenant des deux puces de DEL. De cette manière, les boîtiers de DEL selon la présente invention peuvent être avantageux pour diverses applications, y compris celles où une intensité lumineuse élevée est souhaitée dans diverses conditions environnementales. De telles applications comprennent l'éclairage automobile, l'éclairage aérospatial et l'éclairage général. |
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AbstractList | Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.
L'invention concerne des dispositifs électroluminescents à semi-conducteurs comprenant des diodes électroluminescentes (DEL), et plus particulièrement des DEL encapsulées. Dans certains modes de réalisation, un boîtier de DEL comprend des connexions électriques qui sont configurées pour réduire la corrosion de métaux à l'intérieur du boîtier de DEL ; ou diminuer la tension directe globale du boîtier de DEL ; ou fournir un trajet électrique pour des puces à décharge électrostatique connectées en série (ESD). Dans certains modes de réalisation, un boîtier de DEL comprend au moins deux puces de DEL et un matériau entre les deux puces de DEL qui favorise l'homogénéité des émissions composites provenant des deux puces de DEL. De cette manière, les boîtiers de DEL selon la présente invention peuvent être avantageux pour diverses applications, y compris celles où une intensité lumineuse élevée est souhaitée dans diverses conditions environnementales. De telles applications comprennent l'éclairage automobile, l'éclairage aérospatial et l'éclairage général. |
Author | DAVIS, Kenneth SHI, Xiameng PARK, Jae-Hyung MURTHY, Roshan |
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Snippet | Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | LIGHT-EMITTING DIODE PACKAGES |
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