SEMICONDUCTOR DEVICE PACKAGE

• Main Authors: LEE, Seung Jae, LEE, Yeong June, LEE, Koh Eun, KANG, Hui Seong, SONG, Sung Joo, JIN, Min Ji
• Format: Patent
• Language: English; French; Korean
• Published: 19.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor devic...