ARTICLE INCLUDING METALLIZED VIAS AND METHOD FOR MANUFACTURING THE SAME

An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is fr...

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Bibliographic Details
Main Author JAYARAMAN, Shrisudersan
Format Patent
LanguageEnglish
French
Published 01.08.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface. Un article comprend une tranche ayant un corps qui définit une première surface et une seconde surface. La tranche définit un trou d'interconnexion ayant une surface de trou d'interconnexion s'étendant entre les première et seconde surfaces à travers le corps. Une couche d'adhérence est positionnée sur la surface de trou d'interconnexion. Au moins une partie de la surface de trou d'interconnexion est exempte de la couche d'adhérence. Un composant métallique est positionné à l'intérieur du trou d'interconnexion et s'étend de la première surface à la seconde surface.
Bibliography:Application Number: WO2019US15402