SUBSTRATE POLISHING DEVICE AND METHOD FOR DISCHARGING POLISHING FLUID IN SUBSTRATE POLISHING DEVICE

• Main Authors: TOGAWA, Tetsuji, KOBAYASHI, Kenichi
• Format: Patent
• Language: English; French; Japanese
• Published: 28.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

In a substrate polishing device in which a polishing fluid passes through the inside of a rotary joint, maintenance of the rotary joint is required. Disclosed is a substrate polishing device having: a polishing head for holding a substrate; a rotary table provided with a first opening on a surface t...