CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING
A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule), and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R1 2R2SiO...
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Format | Patent |
Language | English French |
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06.12.2018
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Abstract | A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule), and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R1 2R2SiO1/2 unit, and R1 3SiO1/2 unit; (B) an organopolysiloxane that has an average of at least three silicon-bonded hydrogen atoms in each molecule, wherein component (B) is an organopolysiloxane comprising (B-1) an organopolysiloxane that contains at least 0.7 mass % silicon-bonded hydrogen and that comprises SiO4/2 units and HR3 2SiO1/2 units in a ratio ranging from 1.50 to 2.50 moles of HR3 2SiO1/2 units per 1 mole of SiO4/2 units, at 50 to 100 mass % of component (B), and (B-2) a straight-chain organopolysiloxane that contains at least 0.3 mass % silicon-bonded hydrogen, at 0 to 50 mass % of component (B); and (C) a hydrosilylation reaction catalyst.
L'invention concerne une composition de silicone durcissable comprenant (A) un organopolysiloxane contenant un alcényle comprenant (A-1) un dialkylpolysiloxane qui a une moyenne d'au moins deux groupes alcényle dans chaque molécule, et (A-2) un organopolysiloxane à base de résine contenant de l'alcényle qui comprend le motif SiO4/2, le motif R1 2R2SiO1/2, et le motif R1 3SiO1/2 ; (B) un organopolysiloxane qui a une moyenne d'au moins trois atomes d'hydrogène liés au silicium dans chaque molécule, le constituant (B) étant un organopolysiloxane comprenant (B-1) un organopolysiloxane qui contient au moins 0,7 % en masse d'hydrogène lié au silicium et qui comprend des motifs SiO4/2 et des motifs HR3 2SiO1/2 dans un rapport allant de 1,50 à 2,50 moles de motifs HR3 2SiO1/2 pour 1 mole de motifs SiO4/2, à 50 à 100 % en masse de constituant (B), et (B-2) un organopolysiloxane à chaîne droite qui contient au moins 0,3 % en masse d'hydrogène lié au silicium, à 0 à 50 % en masse de constituant (B) ; et (C) un catalyseur de réaction d'hydrosilylation. |
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AbstractList | A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule), and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R1 2R2SiO1/2 unit, and R1 3SiO1/2 unit; (B) an organopolysiloxane that has an average of at least three silicon-bonded hydrogen atoms in each molecule, wherein component (B) is an organopolysiloxane comprising (B-1) an organopolysiloxane that contains at least 0.7 mass % silicon-bonded hydrogen and that comprises SiO4/2 units and HR3 2SiO1/2 units in a ratio ranging from 1.50 to 2.50 moles of HR3 2SiO1/2 units per 1 mole of SiO4/2 units, at 50 to 100 mass % of component (B), and (B-2) a straight-chain organopolysiloxane that contains at least 0.3 mass % silicon-bonded hydrogen, at 0 to 50 mass % of component (B); and (C) a hydrosilylation reaction catalyst.
L'invention concerne une composition de silicone durcissable comprenant (A) un organopolysiloxane contenant un alcényle comprenant (A-1) un dialkylpolysiloxane qui a une moyenne d'au moins deux groupes alcényle dans chaque molécule, et (A-2) un organopolysiloxane à base de résine contenant de l'alcényle qui comprend le motif SiO4/2, le motif R1 2R2SiO1/2, et le motif R1 3SiO1/2 ; (B) un organopolysiloxane qui a une moyenne d'au moins trois atomes d'hydrogène liés au silicium dans chaque molécule, le constituant (B) étant un organopolysiloxane comprenant (B-1) un organopolysiloxane qui contient au moins 0,7 % en masse d'hydrogène lié au silicium et qui comprend des motifs SiO4/2 et des motifs HR3 2SiO1/2 dans un rapport allant de 1,50 à 2,50 moles de motifs HR3 2SiO1/2 pour 1 mole de motifs SiO4/2, à 50 à 100 % en masse de constituant (B), et (B-2) un organopolysiloxane à chaîne droite qui contient au moins 0,3 % en masse d'hydrogène lié au silicium, à 0 à 50 % en masse de constituant (B) ; et (C) un catalyseur de réaction d'hydrosilylation. |
Author | VAN TIGGELEN, Kevin BEUKEMA, Martin LEADLEY, Stuart DENT, Stanton MCDONALD, Joel DESCAMPS, Pierre |
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Snippet | A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least... |
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Title | CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING |
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