THERMAL BUBBLE INKJET PRINT HEAD CHIP AND MANUFACTURING METHOD THEREFOR

• Main Authors: WANG, Xiaowei, ZHANG, Hua, GUAN, Yimin
• Format: Patent
• Language: Chinese; English; French
• Published: 05.07.2018
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

Disclosed are a thermal bubble inkjet print head chip and a manufacturing method therefor. The print head chip comprises a substrate (11), a heating resistor (12) formed at a first side of the substrate, and an ink accommodating cavity (13) formed at one side of the heating resistor distant from the substrate. A low heat conduction cavity (14) is formed in the substrate; the low heat conduction cavity is located at one side of the heating resistor distant from the ink accommodating cavity; the low heat conduction cavity is filled with a material having a heat conduction efficiency lower than the substrate. By means of the low heat conduction cavity, the amount of heat generated by the heating resistor and diffusing to the substrate is reduced, and the heating efficiency of the heating resistor is improved; therefore, the working current of the heating resistor can be correspondingly lowered. The present invention reduces the working current of the print head and the temperature rising rate of the substrate wh