CURED BODY AND MULTILAYERED SUBSTRATE
Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including an epoxy compound, a curing agent, an inorganic filler, and a p...
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Format | Patent |
Language | English French Japanese |
Published |
05.04.2018
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Abstract | Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including an epoxy compound, a curing agent, an inorganic filler, and a polyimide, the content of the inorganic filler in 100 wt.% of the cured body is 30 to 90 wt.% (inclusive), the cured body has a sea-island structure having sea parts and island parts, the average major axis of the island parts is 5 μm or less, and the island parts include the polyimide.
L'invention concerne un corps durci pouvant améliorer l'adhérence entre une couche d'isolation et une couche métallique et réduire la rugosité de la surface de la couche d'isolation. Ce corps durci est un corps durci d'une composition de résine comprenant un composé époxy, un agent de durcissement, une charge inorganique et un polyimide, la teneur en charge inorganique dans 100 % en poids du corps durci étant de 30-90 % en poids (valeurs extrêmes incluses), le corps durci présentant une structure de mer-île présentant des parties de mer et des parties d'île, le grand axe moyen des parties d'île étant de 5 µm ou moins et les parties d'île comprenant le polyimide.
絶縁層と金属層との密着性を高め、かつ絶縁層の表面の表面粗さを小さくすることができる硬化体を提供する。 本発明に係る硬化体は、エポキシ化合物と硬化剤と無機充填材とポリイミドとを含む樹脂組成物の硬化体であり、前記硬化体100重量%中、前記無機充填材の含有量が30重量%以上、90重量%以下であり、前記硬化体は、海部と島部とを有する海島構造を有し、前記島部の平均長径が5μm以下であり、前記島部が前記ポリイミドを含む。 |
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AbstractList | Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including an epoxy compound, a curing agent, an inorganic filler, and a polyimide, the content of the inorganic filler in 100 wt.% of the cured body is 30 to 90 wt.% (inclusive), the cured body has a sea-island structure having sea parts and island parts, the average major axis of the island parts is 5 μm or less, and the island parts include the polyimide.
L'invention concerne un corps durci pouvant améliorer l'adhérence entre une couche d'isolation et une couche métallique et réduire la rugosité de la surface de la couche d'isolation. Ce corps durci est un corps durci d'une composition de résine comprenant un composé époxy, un agent de durcissement, une charge inorganique et un polyimide, la teneur en charge inorganique dans 100 % en poids du corps durci étant de 30-90 % en poids (valeurs extrêmes incluses), le corps durci présentant une structure de mer-île présentant des parties de mer et des parties d'île, le grand axe moyen des parties d'île étant de 5 µm ou moins et les parties d'île comprenant le polyimide.
絶縁層と金属層との密着性を高め、かつ絶縁層の表面の表面粗さを小さくすることができる硬化体を提供する。 本発明に係る硬化体は、エポキシ化合物と硬化剤と無機充填材とポリイミドとを含む樹脂組成物の硬化体であり、前記硬化体100重量%中、前記無機充填材の含有量が30重量%以上、90重量%以下であり、前記硬化体は、海部と島部とを有する海島構造を有し、前記島部の平均長径が5μm以下であり、前記島部が前記ポリイミドを含む。 |
Author | NISHIMURA, Takashi HAYASHI, Tatsushi BABA, Susumu |
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DocumentTitleAlternate | CORPS DURCI ET SUBSTRAT MULTICOUCHE 硬化体及び多層基板 |
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RelatedCompanies | SEKISUI CHEMICAL CO., LTD |
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Snippet | Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the... |
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SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
Title | CURED BODY AND MULTILAYERED SUBSTRATE |
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