EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME

• Main Authors: LEE, Yoon Man, KIM, Jae Hyun, LEE, Eun Jung, IM, Su Mi, EOM, Tae Shin
• Format: Patent
• Language: English; French; Korean
• Published: 21.12.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less. La présente invention concerne une composition de résine époxy destinée à encapsuler un dispositif semi-conducteur, ainsi qu'un procédé de préparation associé, et un dispositif semi-conducteur encapsulé à l'aide de celle-ci, la composition de résine époxy, qui comprend une résine époxy, un agent de durcissement, une charge inorganique, et un ou plusieurs additifs choisis dans le groupe constitué par un accélérateur de durcissement, un agent de couplage, un agent de libération et un colorant, présente une teneur en gel d'environ 1 ppm ou moins. 본 발명은, 에폭시 수지, 경화제, 무기 충전제, 및 경화촉진제, 커플링제, 이형제 및 착색제로 이루어진 군으로부터 선택된 1종 이상의 첨가제를 포함하고, 겔 함량이 약 1ppm 이하인 반도체 밀봉용 에폭시 수지 조성물, 그 제조 방법 및 이를 이용해 밀봉된 반도체 소자에 관한 것이다.