PLASMA PRESS APPARATUS AND BONDING METHOD USING SAME

• Main Authors: MUN, Mu Kyeom, YEOM, Won Kyun, PARK, Jinwoo, YEOM, Geunyoung, PARK, Sung Woo, SUNG, Dain, KIM, Ki Hyun, KIM, Doo San
• Format: Patent
• Language: English; French; Korean
• Published: 09.11.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a plasma press apparatus and a bonding method using same, by which two substrates being bonded in a state where plasma is generated are bonded while being pressurized, and thus notably improved bonding force compared to existing inventions is provided, and thermal damage to a substrate being bonded may be prevented since bonding may be performed without a separate heating process. La présente invention concerne un appareil de presse à plasma et un procédé de liaison utilisant celui-ci, par lesquels deux substrats liés dans un état où le plasma est produit sont liés tout en étant mis sous pression, obtenant ainsi une force de liaison particulièrement améliorée par rapport aux inventions existantes, et l'endommagement thermique sur un substrat qui est lié pouvant être évité étant donné que la liaison peut être réalisée sans processus de chauffage séparé. 본 발명은 플라즈마 프레스 장치 및 이를 접합방법에 관한 것으로, 플라즈마 를 발생한 상태에서 접합되는 두 기재를 가압하면서 접합하여 종래보다 현저하게 향상된 접합력을 제공하며, 별도의 가열 공정 없이도 접합이 가능하여 접합하는 기재에 열손상을 방지할 수 있는 것을 특징으로 한다.