SILICON PMOS WITH GALLIUM NITRIDE NMOS FOR VOLTAGE REGULATION
This disclosure pertains to a gallium nitride transistor that is formed in a trench etched into a silicon substrate. A gallium nitride layer is on the trench of the silicon substrate. A source electrode and a drain electrode reside on the gallium nitride layer. A gate electrode resides on the galliu...
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Format | Patent |
Language | English French |
Published |
05.10.2017
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Abstract | This disclosure pertains to a gallium nitride transistor that is formed in a trench etched into a silicon substrate. A gallium nitride layer is on the trench of the silicon substrate. A source electrode and a drain electrode reside on the gallium nitride layer. A gate electrode resides on the gallium nitride layer between the source electrode and the drain electrode. A first polarization layer resides on the gallium nitride layer between the source electrode and the gate electrode, and a second polarization layer resides on the gallium nitride layer between the gate electrode and the drain electrode. The silicon substrate can include a silicon 111 substrate.
La présente invention concerne un transistor au nitrure de gallium qui est formé dans une tranchée gravée dans un substrat de silicium. Une couche de nitrure de gallium se trouve sur la tranchée du substrat de silicium. Une électrode de source et une électrode de drain sont situées sur la couche de nitrure de gallium. Une électrode de grille est située sur la couche de nitrure de gallium entre l'électrode de source et l'électrode de drain. Une première couche de polarisation est située sur la couche de nitrure de gallium entre l'électrode de source et l'électrode de grille, et une seconde couche de polarisation est située sur la couche de nitrure de gallium entre l'électrode de grille et l'électrode de drain. Le substrat de silicium peut comprendre un substrat de silicium (111). |
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AbstractList | This disclosure pertains to a gallium nitride transistor that is formed in a trench etched into a silicon substrate. A gallium nitride layer is on the trench of the silicon substrate. A source electrode and a drain electrode reside on the gallium nitride layer. A gate electrode resides on the gallium nitride layer between the source electrode and the drain electrode. A first polarization layer resides on the gallium nitride layer between the source electrode and the gate electrode, and a second polarization layer resides on the gallium nitride layer between the gate electrode and the drain electrode. The silicon substrate can include a silicon 111 substrate.
La présente invention concerne un transistor au nitrure de gallium qui est formé dans une tranchée gravée dans un substrat de silicium. Une couche de nitrure de gallium se trouve sur la tranchée du substrat de silicium. Une électrode de source et une électrode de drain sont situées sur la couche de nitrure de gallium. Une électrode de grille est située sur la couche de nitrure de gallium entre l'électrode de source et l'électrode de drain. Une première couche de polarisation est située sur la couche de nitrure de gallium entre l'électrode de source et l'électrode de grille, et une seconde couche de polarisation est située sur la couche de nitrure de gallium entre l'électrode de grille et l'électrode de drain. Le substrat de silicium peut comprendre un substrat de silicium (111). |
Author | RAO, Valluri R DASGUPTA, Sansaptak KOTLYAR, Roza RADOSAVLJEVIC, Marko THEN, Han Wui TOLCHINSKY, Peter G |
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DocumentTitleAlternate | PMOS DE SILICIUM AVEC NMOS DE NITRURE DE GALLIUM POUR LA RÉGULATION DE TENSION |
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Snippet | This disclosure pertains to a gallium nitride transistor that is formed in a trench etched into a silicon substrate. A gallium nitride layer is on the trench... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SILICON PMOS WITH GALLIUM NITRIDE NMOS FOR VOLTAGE REGULATION |
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