GLASS INTERPOSER MODULE, IMAGE CAPTURE DEVICE, AND ELECTRONIC DEVICE

The present disclosure relates to a glass interposer module with which the development of distortion due to thermal expansion during manufacturing can be reduced, an image device, and an electronic device. Between the glass interposer and a CMOS image sensor (CIS), a light-transmissive member is fil...

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Bibliographic Details
Main Authors AKIBA Akira, HASHIMOTO Mitsuo, KABASAWA Hidetoshi
Format Patent
LanguageEnglish
French
Japanese
Published 17.08.2017
Subjects
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