GLASS INTERPOSER MODULE, IMAGE CAPTURE DEVICE, AND ELECTRONIC DEVICE
The present disclosure relates to a glass interposer module with which the development of distortion due to thermal expansion during manufacturing can be reduced, an image device, and an electronic device. Between the glass interposer and a CMOS image sensor (CIS), a light-transmissive member is fil...
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Main Authors | , , |
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Format | Patent |
Language | English French Japanese |
Published |
17.08.2017
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Subjects | |
Online Access | Get full text |
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