BONDING METHOD USING PHOTOCURABLE ADHESIVE

• Main Authors: KAWAMURA Naotaka, OKAMURA Naomi, YAMAGA Hiroshi, MIDORIKAWA Tomohiro, KOUNO Shouma
• Format: Patent
• Language: English; French; Japanese
• Published: 15.06.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

Provided are: a photocurable adhesive which is able to be applied to objects to be bonded having various shapes, while having excellent surface curability and quickly exhibiting adhesiveness after light irradiation; a product which contains this adhesive; a bonding method; and a method for producing...