THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE PROVIDED WITH CURED FILM, AND ELECTRONIC COMPONENT

• Main Authors: SUGIHARA, Katsuyuki, MUROTANI, Atsushi, DEYAMA, Yoshihiro, ITAMI, Setsuo, HIROTA, Takayuki, TAKAHASHI, Toshiyuki, MOROKOSHI, Shinta
• Format: Patent
• Language: English; French; Japanese
• Published: 11.05.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided are: a thermosetting resin composition including a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, an epoxy curing agent (C), and a colorant (D), the thermosetting resin composition being capable of forming a cured film having an excellent balance of hardness and...