VOID STRUCTURED FILM BONDED THROUGH CATALYTIC ACTION AND METHOD FOR MANUFACTURING SAME

• Main Authors: HATTORI DAISUKE, MURAKAMI NAO, NAKAMURA KOZO, UWADA KAZUKI, HARUTA HIROMOTO, TAKEMOTO HIROYUKI
• Format: Patent
• Language: English; French; Japanese
• Published: 30.06.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The purpose of the present invention is to provide, for example, a void structured film in which a porous structure with a high porosity is formed while preventing cracking and which has a high strength. The void structured film according to the present invention is characterized in that one or more...