THERMAL RECOVERY ARTICLE, WIRE SPLICE, AND WIRE HARNESS
The objective of the present invention is to provide: a thermal recovery article that has superior copper damage resistance, has a low occurrence of blooms and bleeds, and undergoes heat contraction within an appropriate temperature range; and a wire harness and wire splice that use the thermal reco...
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Format | Patent |
Language | English French Japanese |
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14.05.2015
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Abstract | The objective of the present invention is to provide: a thermal recovery article that has superior copper damage resistance, has a low occurrence of blooms and bleeds, and undergoes heat contraction within an appropriate temperature range; and a wire harness and wire splice that use the thermal recovery article. The cylindrical thermal recovery article is provided with a substrate layer, the substrate layer contains at least two types of polyolefin resin and an oxidation inhibitor, the substrate layer has one melting point peak temperature, the melting point peak temperature is 112-128°C inclusive, the heat of fusion of the entirety of the resin components of the substrate layer is 80-130 J/g inclusive, and the oxidation induction temperature of the substrate layer is 265-280°C inclusive.
La présente invention a pour objectif de fournir un article de récupération thermique présentant une meilleure résistance à une dégradation du cuivre, qui présente une faible occurrence d'efflorescences et de ressuages, et subit une contraction thermique sur une plage appropriée de températures ; et un faisceau de fils et une épissure de fils qui utilisent l'article de récupération thermique. L'article cylindrique de récupération thermique est pourvu d'une couche de substrat, la couche de substrat contenant au moins deux types de résines de polyoléfine et un inhibiteur d'oxydation, la couche de substrat ayant une température maximale du point de fusion, la température maximale du point de fusion étant de 112 à 128 °C, limites comprises, la chaleur de fusion de la totalité des composants résines de la couche de substrat étant de 80 à 130 J/g, limites comprises, et la température d'induction de l'oxydation de la couche de substrat étant de 265 à 280 °C, limites comprises.
本発明は、適切な温度範囲で熱収縮し、かつブルーム及びブリードの発生が少なく、耐銅害性に優れた熱回復物品、この熱回復物品を使用したワイヤスプライス及びワイヤハーネスを提供することを目的とする。本発明に係る熱回復物品は、基材層を備える円筒状の熱回復物品であって、上記基材層が酸化防止剤と2種以上のポリオレフィン系樹脂とを含有し、上記基材層が1つの融点ピーク温度を有し、この融点ピーク温度が112℃以上128℃以下であり、上記基材層の樹脂成分全体の融解熱量が80J/g以上130J/g以下であり、かつこの基材層の酸化誘導温度が265℃以上280℃以下である。 |
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AbstractList | The objective of the present invention is to provide: a thermal recovery article that has superior copper damage resistance, has a low occurrence of blooms and bleeds, and undergoes heat contraction within an appropriate temperature range; and a wire harness and wire splice that use the thermal recovery article. The cylindrical thermal recovery article is provided with a substrate layer, the substrate layer contains at least two types of polyolefin resin and an oxidation inhibitor, the substrate layer has one melting point peak temperature, the melting point peak temperature is 112-128°C inclusive, the heat of fusion of the entirety of the resin components of the substrate layer is 80-130 J/g inclusive, and the oxidation induction temperature of the substrate layer is 265-280°C inclusive.
La présente invention a pour objectif de fournir un article de récupération thermique présentant une meilleure résistance à une dégradation du cuivre, qui présente une faible occurrence d'efflorescences et de ressuages, et subit une contraction thermique sur une plage appropriée de températures ; et un faisceau de fils et une épissure de fils qui utilisent l'article de récupération thermique. L'article cylindrique de récupération thermique est pourvu d'une couche de substrat, la couche de substrat contenant au moins deux types de résines de polyoléfine et un inhibiteur d'oxydation, la couche de substrat ayant une température maximale du point de fusion, la température maximale du point de fusion étant de 112 à 128 °C, limites comprises, la chaleur de fusion de la totalité des composants résines de la couche de substrat étant de 80 à 130 J/g, limites comprises, et la température d'induction de l'oxydation de la couche de substrat étant de 265 à 280 °C, limites comprises.
本発明は、適切な温度範囲で熱収縮し、かつブルーム及びブリードの発生が少なく、耐銅害性に優れた熱回復物品、この熱回復物品を使用したワイヤスプライス及びワイヤハーネスを提供することを目的とする。本発明に係る熱回復物品は、基材層を備える円筒状の熱回復物品であって、上記基材層が酸化防止剤と2種以上のポリオレフィン系樹脂とを含有し、上記基材層が1つの融点ピーク温度を有し、この融点ピーク温度が112℃以上128℃以下であり、上記基材層の樹脂成分全体の融解熱量が80J/g以上130J/g以下であり、かつこの基材層の酸化誘導温度が265℃以上280℃以下である。 |
Author | YAMASAKI, SATOSHI EMOTO, YASUTAKA FUKUMOTO, RIYOUTA |
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DocumentTitleAlternate | ARTICLE DE RÉCUPÉRATION THERMIQUE, ÉPISSURE DE FIL ET FAISCEAU DE FILS 熱回復物品、ワイヤスプライス及びワイヤハーネス |
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RelatedCompanies | SUMITOMO ELECTRIC FINE POLYMER, INC SUMITOMO ELECTRIC INDUSTRIES,LTD |
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Snippet | The objective of the present invention is to provide: a thermal recovery article that has superior copper damage resistance, has a low occurrence of blooms and... |
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SubjectTerms | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
Title | THERMAL RECOVERY ARTICLE, WIRE SPLICE, AND WIRE HARNESS |
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