POLISHING COMPOSITION

• Main Author: TAMADA, SHUICHI
• Format: Patent
• Language: English; French; Japanese
• Published: 02.04.2015
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; TRANSPORTING

The present invention provides a polishing composition having excellent storage stability. The present invention is a polishing composition comprising abrasive grains and an oxidizing agent containing a halogen atom, wherein a value (A/B) determined by dividing the sum total (A) (unit: groups) of silanol groups contained in the abrasive grains in the polishing composition by the concentration (B) (unit: % by mass) of the oxidizing agent in the polishing composition is 8 × 1023 or less. La présente invention concerne une composition de polissage possédant une excellente stabilité au stockage. La présente invention concerne une composition de polissage qui comprend des grains abrasifs et un agent oxydant contenant un atome d'halogène, dont une valeur (A/B) définie en divisant la somme totale (A) (unité : groupes) des groupes silanol contenus dans les grains abrasifs de la composition de polissage par la concentration (B) (unité : % en poids) de l'agent oxydant dans la composition de polissage est inférieure ou égale à 8 x 1023. 　本発明は、保管安定性に優れた研磨用組成物を提供する。　本発明は、砥粒とハロゲン原子を含有する酸化剤と、を含み、研磨用組成物中の前記砥粒が有するシラノール基数の総和（Ａ）（単位：個）を研磨用組成物中の前記酸化剤の濃度（Ｂ）（単位：質量％）で除した値（Ａ／Ｂ）が、８×１０２３以下である、研磨用組成物である。