CARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: DEEBEN, JOSEPHUS PAULUS AUGUSTINUS, VAN WIJK, ROB
• Format: Patent
• Language: English; French
• Published: 19.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A carrier structure (210) and a method (300) of manufacturing a carrier structure are provided. The carrier structure comprises a carrier substrate (230) and a heat sink portion (240). The carrier substrate is arranged to support at least one electronic element (220), and the heat sink portion is ar...