ARTICLE AND ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION
Provided is an article that has high scratch resistance and good fingerprint wiping-off property. The article, which has a fine uneven structure containing a cured product of a resin composition on the surface, wherein the push-in elastic modulus (X) [MPa] and creep deformation ratio (Y)[%] of the c...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
19.12.2013
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Subjects | |
Online Access | Get full text |
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Abstract | Provided is an article that has high scratch resistance and good fingerprint wiping-off property. The article, which has a fine uneven structure containing a cured product of a resin composition on the surface, wherein the push-in elastic modulus (X) [MPa] and creep deformation ratio (Y)[%] of the cured product satisfy the following requirements (1) and (2). 80<=X<=560 (1) Y<=(0.00022X-0.01)×100 (2)
L'invention concerne un article qui présente une résistance élevée aux éraflures et une bonne caractéristique de nettoyage des empreintes digitales. Cet article comporte sur sa surface une structure fine irrégulière contenant un produit durci d'une composition de résine, le module élastique à l'enfoncement (X) [MPa] et le rapport de déformation par fluage (Y)[%] du produit durci répondant aux exigences (1) et (2) suivantes : (1) 80<=X<=560, (2) Y<=(0,00022X-0,01)×100. |
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AbstractList | Provided is an article that has high scratch resistance and good fingerprint wiping-off property. The article, which has a fine uneven structure containing a cured product of a resin composition on the surface, wherein the push-in elastic modulus (X) [MPa] and creep deformation ratio (Y)[%] of the cured product satisfy the following requirements (1) and (2). 80<=X<=560 (1) Y<=(0.00022X-0.01)×100 (2)
L'invention concerne un article qui présente une résistance élevée aux éraflures et une bonne caractéristique de nettoyage des empreintes digitales. Cet article comporte sur sa surface une structure fine irrégulière contenant un produit durci d'une composition de résine, le module élastique à l'enfoncement (X) [MPa] et le rapport de déformation par fluage (Y)[%] du produit durci répondant aux exigences (1) et (2) suivantes : (1) 80<=X<=560, (2) Y<=(0,00022X-0,01)×100. |
Author | MAKINO, SHINJI NAKAI, YUSUKE YASUKAWA, KEIKO OTANI, GO MORI, SEIICHIRO IKAWA, MASASHI |
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DocumentTitleAlternate | ARTICLE ET COMPOSITION DE RÉSINE DURCISSABLE PAR DES RAYONS D'ÉNERGIE ACTIVE |
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RelatedCompanies | MITSUBISHI RAYON CO., LTD |
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Snippet | Provided is an article that has high scratch resistance and good fingerprint wiping-off property. The article, which has a fine uneven structure containing a... |
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SubjectTerms | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
Title | ARTICLE AND ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION |
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