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Abstract Disclosed is a substrate for a superconducting film which is a tape-shaped substrate for a superconducting film, comprising: a film deposition face for film deposition of a layered body including a superconducting layer; a reverse face which is a face on the opposite side from the film deposition face; a pair of end faces which are contiguous with the film deposition face and the reverse face; and a pair of lateral faces which are contiguous with the film deposition face, the reverse face, and the pair of end faces. The pair of lateral faces respectively includes expanding faces which expand outwardly from an edge part of the film deposition face toward the reverse face in a planar direction of the film deposition face. Also disclosed are a superconducting wire and a superconducting wire fabrication method. Cette invention concerne un substrat pour un film supraconducteur, et plus particulièrement un substrat en forme de bande pour un film supraconducteur, comprenant : une face destinée au dépôt de film d'un corps stratifié comprenant une couche supraconductrice ; une face opposée à la face de dépôt de film ; une paire de faces d'extrémité contiguës à la face de dépôt de film et à la face opposée ; et une paire de faces latérales contiguës à la face de dépôt de film, à la face opposée et à la paire de faces d'extrémité. La paire de faces latérales comprend respectivement des faces obliques qui s'étendent vers l'extérieur à partir d'une partie formant bord de la face de dépôt de film vers la face opposée dans un sens planaire de la face de dépôt de film. L'invention concerne en outre un fil supraconducteur et un procédé de fabrication de fil supraconducteur.
AbstractList Disclosed is a substrate for a superconducting film which is a tape-shaped substrate for a superconducting film, comprising: a film deposition face for film deposition of a layered body including a superconducting layer; a reverse face which is a face on the opposite side from the film deposition face; a pair of end faces which are contiguous with the film deposition face and the reverse face; and a pair of lateral faces which are contiguous with the film deposition face, the reverse face, and the pair of end faces. The pair of lateral faces respectively includes expanding faces which expand outwardly from an edge part of the film deposition face toward the reverse face in a planar direction of the film deposition face. Also disclosed are a superconducting wire and a superconducting wire fabrication method. Cette invention concerne un substrat pour un film supraconducteur, et plus particulièrement un substrat en forme de bande pour un film supraconducteur, comprenant : une face destinée au dépôt de film d'un corps stratifié comprenant une couche supraconductrice ; une face opposée à la face de dépôt de film ; une paire de faces d'extrémité contiguës à la face de dépôt de film et à la face opposée ; et une paire de faces latérales contiguës à la face de dépôt de film, à la face opposée et à la paire de faces d'extrémité. La paire de faces latérales comprend respectivement des faces obliques qui s'étendent vers l'extérieur à partir d'une partie formant bord de la face de dépôt de film vers la face opposée dans un sens planaire de la face de dépôt de film. L'invention concerne en outre un fil supraconducteur et un procédé de fabrication de fil supraconducteur.
Author HIGUCHI, MASARU
SAKAMOTO, HISAKI
NAGASU, YOSHINORI
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DocumentTitleAlternate SUBSTRAT POUR FILM SUPRACONDUCTEUR, FIL SUPRACONDUCTEUR ET PROCÉDÉ DE FABRICATION DE FIL SUPRACONDUCTEUR
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RelatedCompanies FURUKAWA ELECTRIC CO., LTD
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Snippet Disclosed is a substrate for a superconducting film which is a tape-shaped substrate for a superconducting film, comprising: a film deposition face for film...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CABLES
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F
CONDUCTORS
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
INORGANIC CHEMISTRY
INSULATORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title SUBSTRATE FOR SUPERCONDUCTING FILM, SUPERCONDUCTING WIRE, AND SUPERCONDUCTING WIRE FABRICATION METHOD
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