POLY(AMIC ACID) SOLUTION COMPOSITION, AND POLYIMIDE

• Main Authors: KAMINE, TETSUJI, NAKAYAMA, TAKESHIGE, NAKAYAMA, TOMONORI
• Format: Patent
• Language: English; French; Japanese
• Published: 17.10.2013
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The present invention relates to a poly(amic acid) obtained from monomer components comprising a tetracarboxylic acid component and a diamine component. The poly(amic acid) is characterized in that the monomer components contain not less than 25 mol.% of at least one component selected from among th...