FILM FORMATION METHOD AND FILM FORMATION APPARATUS
Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion resistance. A film formation apparatus (1) in which a substrate holder (12) that has a substrate holding surface for holding a plurality of su...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
04.04.2013
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Subjects | |
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Abstract | Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion resistance. A film formation apparatus (1) in which a substrate holder (12) that has a substrate holding surface for holding a plurality of substrates (14) is disposed rotatably within a vacuum vessel (10), said film formation apparatus (1) comprising: an ion source (38) mounted within the vacuum vessel (10) so as to have a configuration, position and orientation such that an ion beam can be radiated to an area that is a part of the substrate holding surface; and a vapor deposition source (34) and a control plate (36) that act as film formation means mounted within the vacuum vessel (10) so as to have a configuration such that the film formation material can be supplied to a region which is a part of the substrate holding surface and which overlaps at least a part of the ion beam radiation area irradiated by the ion source (38).
L'invention concerne un appareil de formation d'un film qui peut former de façon efficace un film anti-contamination qui peut supporter une utilisation réelle tout en ayant également une résistance améliorée à l'abrasion. Un appareil de formation de film (1) dans lequel un porte-substrat (12) qui a une surface de support de substrat pour supporter une pluralité de substrats (14) est disposé de manière rotative à l'intérieur d'un récipient sous vide (10), ledit appareil de formation de film (1) comprenant : une source d'ions (38) montée à l'intérieur du récipient sous vide (10) de façon à avoir une configuration, une position et une orientation telles qu'un faisceau ionique peut être irradié sur une zone qui est une partie de la surface de support de substrat ; et une source de dépôt de vapeur (34) et une plaque de commande (36) qui agissent comme moyens de formation de film montés à l'intérieur du récipient sous vide (10) de façon à avoir une configuration telle que la matière de formation de film peut être adressée à une région qui est une partie de la surface de support de substrat et qui recouvre au moins une partie de la région de radiation de faisceau ionique irradiée par la source d'ions (38). |
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AbstractList | Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion resistance. A film formation apparatus (1) in which a substrate holder (12) that has a substrate holding surface for holding a plurality of substrates (14) is disposed rotatably within a vacuum vessel (10), said film formation apparatus (1) comprising: an ion source (38) mounted within the vacuum vessel (10) so as to have a configuration, position and orientation such that an ion beam can be radiated to an area that is a part of the substrate holding surface; and a vapor deposition source (34) and a control plate (36) that act as film formation means mounted within the vacuum vessel (10) so as to have a configuration such that the film formation material can be supplied to a region which is a part of the substrate holding surface and which overlaps at least a part of the ion beam radiation area irradiated by the ion source (38).
L'invention concerne un appareil de formation d'un film qui peut former de façon efficace un film anti-contamination qui peut supporter une utilisation réelle tout en ayant également une résistance améliorée à l'abrasion. Un appareil de formation de film (1) dans lequel un porte-substrat (12) qui a une surface de support de substrat pour supporter une pluralité de substrats (14) est disposé de manière rotative à l'intérieur d'un récipient sous vide (10), ledit appareil de formation de film (1) comprenant : une source d'ions (38) montée à l'intérieur du récipient sous vide (10) de façon à avoir une configuration, une position et une orientation telles qu'un faisceau ionique peut être irradié sur une zone qui est une partie de la surface de support de substrat ; et une source de dépôt de vapeur (34) et une plaque de commande (36) qui agissent comme moyens de formation de film montés à l'intérieur du récipient sous vide (10) de façon à avoir une configuration telle que la matière de formation de film peut être adressée à une région qui est une partie de la surface de support de substrat et qui recouvre au moins une partie de la région de radiation de faisceau ionique irradiée par la source d'ions (38). |
Author | NAGAE, EKISHU JIANG, YOUSONG SAMORI, SHINGO SHIONO, ICHIRO HAYASHI, TATSUYA MIYAUCHI, MITSUHIRO |
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DocumentTitleAlternate | PROCÉDÉ DE FORMATION D'UN FILM ET APPAREIL DE FORMATION D'UN FILM |
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RelatedCompanies | NAGAE, EKISHU JIANG, YOUSONG SAMORI, SHINGO SHIONO, ICHIRO HAYASHI, TATSUYA SHINCRON CO., LTD MIYAUCHI, MITSUHIRO |
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Snippet | Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | FILM FORMATION METHOD AND FILM FORMATION APPARATUS |
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