EPOXY RESIN COMPOSITION AND PRINTED BOARD OBTAINED USING SAME

The present invention is: an epoxy resin composition containing an epoxy resin, a curing agent, and a reactive flame retardant, the epoxy resin composition characterized in that the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I); and a printed wiring board obtaine...

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Main Authors SAIO, YOSHIHIDE, KIKUCHI, TAKAAKI, KASHIWAZAKI, FUMITO, MORI, TAKAHIRO, TAKAHATA, YOSHINORI
Format Patent
LanguageEnglish
French
Japanese
Published 21.03.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Abstract The present invention is: an epoxy resin composition containing an epoxy resin, a curing agent, and a reactive flame retardant, the epoxy resin composition characterized in that the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I); and a printed wiring board obtained using the epoxy resin composition. (In formula (I), m is an integer 0-400; and X1-X4 are each independently a hydrogen atom or a C1-10 alkyl group.) La présente invention porte sur : une composition de résine époxyde contenant une résine époxyde, un agent durcisseur et un ignifugeant réactif, la composition de résine époxyde étant caractérisée en ce que l'agent durcisseur est une résine phénolique de type biphénylènearalkylique représentée par la formule (I) ; et une carte de câblage imprimé obtenue à l'aide de la composition de résine époxyde. (Dans la formule (I), m représente un nombre entier de 0-400 ; et X1-X4 représentent chacun indépendamment un atome d'hydrogène ou un groupe alkyle en C1-10.
AbstractList The present invention is: an epoxy resin composition containing an epoxy resin, a curing agent, and a reactive flame retardant, the epoxy resin composition characterized in that the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I); and a printed wiring board obtained using the epoxy resin composition. (In formula (I), m is an integer 0-400; and X1-X4 are each independently a hydrogen atom or a C1-10 alkyl group.) La présente invention porte sur : une composition de résine époxyde contenant une résine époxyde, un agent durcisseur et un ignifugeant réactif, la composition de résine époxyde étant caractérisée en ce que l'agent durcisseur est une résine phénolique de type biphénylènearalkylique représentée par la formule (I) ; et une carte de câblage imprimé obtenue à l'aide de la composition de résine époxyde. (Dans la formule (I), m représente un nombre entier de 0-400 ; et X1-X4 représentent chacun indépendamment un atome d'hydrogène ou un groupe alkyle en C1-10.
Author KIKUCHI, TAKAAKI
MORI, TAKAHIRO
KASHIWAZAKI, FUMITO
SAIO, YOSHIHIDE
TAKAHATA, YOSHINORI
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MORI, TAKAHIRO
KASHIWAZAKI, FUMITO
SAIO, YOSHIHIDE
TAKAHATA, YOSHINORI
ADEKA CORPORATION
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Snippet The present invention is: an epoxy resin composition containing an epoxy resin, a curing agent, and a reactive flame retardant, the epoxy resin composition...
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SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Title EPOXY RESIN COMPOSITION AND PRINTED BOARD OBTAINED USING SAME
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