SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION

• Main Authors: TODA, JUNKO, HIRATSUKA, ICHIRO, YOSHIOKA, OSAMU, KANAZAWA, TAKUYA, TSUKAMOTO, TAKEHITO, CHIBA, RYOTA, SAITO, MASAKO, WADA, MASAHIRO
• Format: Patent
• Language: English; French; Japanese
• Published: 15.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A silicon-containing curable composition comprising: 100 parts by mass of a silicon-containing polymer with Mw of 3000 to 100,000, said silicon-containing polymer being obtained by hydrolyzing and condensing an organosilane mixture which comprises 5 to 50 mol% of R1SiX3, 0 to 50 mol% of R2SiX3, 0 to...