PROCESS AND SYSTEM FOR VARYING THE EXPOSURE TO A CHEMICAL AMBIENT IN A PROCESS CHAMBER
A processing system is disclosed for conducting various processes on substrates, such as semiconductor wafers by varying the exposure to a chemical ambient. The processing system includes a processing region having an inlet and an outlet for flowing fluids through the chamber. The outlet is in commu...
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Format | Patent |
Language | English French |
Published |
10.12.2009
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Abstract | A processing system is disclosed for conducting various processes on substrates, such as semiconductor wafers by varying the exposure to a chemical ambient. The processing system includes a processing region having an inlet and an outlet for flowing fluids through the chamber. The outlet is in communication with a conductance valve that is positioned in between the processing region outlet and a vacuum exhaust channel. The conductance valve rapidly oscillates or rotates between open and closed positions for controlling conductance through the processing region. This feature is coupled with the ability to rapidly pulse chemical species through the processing region while simultaneously controlling the pressure in the processing region. Of particular advantage, the conductance valve is capable of transitioning the processing region through pressure transitions of as great as 100:1 while chemical species are flowed through the processing region using equally fast control valves in a synchronous pulsed fashion.
L'invention porte sur un système de traitement destiné à mettre en oevre différents procédés sur des substrats, tels que des tranches semi-conductrices, par une variation de l'exposition à une ambiance chimique. Le système de traitement comprend une région de traitement ayant une entrée et une sortie, pour permettre l'écoulement de fluides à travers la chambre. La sortie est en communication avec une valve de conductance qui est positionnée entre la sortie de la région de traitement et un canal d'évacuation par aspiration. La valve de conductance subit une oscillation ou une rotation rapide entre la position ouverte et la position fermée, pour réguler la conductance à travers la région de traitement. Cette caractéristique est couplée à la possibilité de pulser rapidement des espèces chimiques à travers la région de traitement tout en régulant simultanément la pression dans la région de traitement. Ce qui est particulièrement avantageux est que la valve de conductance est capable d'assurer la transition avec la région de traitement, en passant par des transitions de pression atteignant 100:1, tandis que les espèces chimiques s'écoulent à travers la région de traitement, par utilisation de valves de régulation tout aussi rapides d'une manière pulsée synchrone. |
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AbstractList | A processing system is disclosed for conducting various processes on substrates, such as semiconductor wafers by varying the exposure to a chemical ambient. The processing system includes a processing region having an inlet and an outlet for flowing fluids through the chamber. The outlet is in communication with a conductance valve that is positioned in between the processing region outlet and a vacuum exhaust channel. The conductance valve rapidly oscillates or rotates between open and closed positions for controlling conductance through the processing region. This feature is coupled with the ability to rapidly pulse chemical species through the processing region while simultaneously controlling the pressure in the processing region. Of particular advantage, the conductance valve is capable of transitioning the processing region through pressure transitions of as great as 100:1 while chemical species are flowed through the processing region using equally fast control valves in a synchronous pulsed fashion.
L'invention porte sur un système de traitement destiné à mettre en oevre différents procédés sur des substrats, tels que des tranches semi-conductrices, par une variation de l'exposition à une ambiance chimique. Le système de traitement comprend une région de traitement ayant une entrée et une sortie, pour permettre l'écoulement de fluides à travers la chambre. La sortie est en communication avec une valve de conductance qui est positionnée entre la sortie de la région de traitement et un canal d'évacuation par aspiration. La valve de conductance subit une oscillation ou une rotation rapide entre la position ouverte et la position fermée, pour réguler la conductance à travers la région de traitement. Cette caractéristique est couplée à la possibilité de pulser rapidement des espèces chimiques à travers la région de traitement tout en régulant simultanément la pression dans la région de traitement. Ce qui est particulièrement avantageux est que la valve de conductance est capable d'assurer la transition avec la région de traitement, en passant par des transitions de pression atteignant 100:1, tandis que les espèces chimiques s'écoulent à travers la région de traitement, par utilisation de valves de régulation tout aussi rapides d'une manière pulsée synchrone. |
Author | CHOY, SHUEN, CHUN CARDEMA, RUDY, SANTO TOMAS DEVINE, DANIEL, J HU, YAO, ZHI PHAN, HUNG, THANH GALEWSKI, CARL PEUSE, BRUCE, W |
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DocumentTitleAlternate | PROCÉDÉ ET SYSTÈME POUR FAIRE VARIER L'EXPOSITION À UNE AMBIANCE CHIMIQUE DANS UNE CHAMBRE DE TRAITEMENT |
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RelatedCompanies | MATTSON TECHNOLOGY, INC CHOY, SHUEN, CHUN CARDEMA, RUDY, SANTO TOMAS DEVINE, DANIEL, J HU, YAO, ZHI PHAN, HUNG, THANH GALEWSKI, CARL PEUSE, BRUCE, W |
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Snippet | A processing system is disclosed for conducting various processes on substrates, such as semiconductor wafers by varying the exposure to a chemical ambient.... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | PROCESS AND SYSTEM FOR VARYING THE EXPOSURE TO A CHEMICAL AMBIENT IN A PROCESS CHAMBER |
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