HOT MELT ADHESIVE
Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soj...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
09.10.2008
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Subjects | |
Online Access | Get full text |
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